s72ns512rd0khfm0 Meet Spansion Inc., s72ns512rd0khfm0 Datasheet - Page 8

• Manufacturer Part Number: s72ns512rd0khfm0
• Description: Mirrorbit Flash Memory And Dram128/256/512 Mb 8/16/32 M X 16 Bit , 1.8 Volt-onlymultiplexed Simultaneous Read/writeburst Mode Flash Memory128/256 Mb 8/16 M X 16 Bit Ddr Dram On Split Bus
• Manufacturer: Meet Spansion Inc.

5.
8
S72NS
Ordering Information
256
The order number (Valid Combination) is formed by the following:
Notes
1. Packing Type 0 is standard. Specify other options as required.
2. BGA package marking omits leading “S” and packing type designator from ordering part number.
3. Valid Combinations list configurations planned to be supported in volume for this device. Consult your local sales office to confirm
R
availability of specific valid combinations and to check on newly released combinations.
Product
Family
S72NS
D0
AH
Density (Mb)
Code Flash
128
256
512
B
D a t a
L
Technology
Process
C
R
S h e e t
S72NS-R Based MCPs
3
PACKING TYPE
0 = Tray
3 = 13-inch Tape and Reel
FLASH and DDR SPEED
0 = 83 MHz Flash, 166 MHz DDR DRAM
4 = 104 MHz Flash, 166 MHz DDR DRAM
DDR Supplier
G = DRAM Type 1 x16 DDR DRAM
L = DRAM Type 5 x16 DDR DRAM
M = DRAM Type 6 x16 DDR DRAM
PACKAGE MODIFIER
B = 133-ball, 8x8mm, FBGA MCP
G = 133-ball, 11x10mm, FBGA MCP
PACKAGE AND MATERIAL TYPE
AH = Thin profile Fine-pitch BGA Pb-free Low-Halogen MCP (0.5 mm pitch)
DDR DRAM AND DATA FLASH DENSITY
D0 = 128 Mb DDR, No Data Flash
E0 = 256 Mb DDR, No Data Flash
PROCESS TECHNOLOGY
R = 65 nm, MirrorBit
CODE FLASH DENSITY
01G = 1 Gb
512 = 512 Mb
256 = 256 Mb
128 = 128 Mb
PRODUCT FAMILY
S72NS Multi-Chip Product (MCP)
1.8 V Multiplexed, SRW, Burst Mode Flash and DDR DRAM on Split Bus
DDR Density
(Mb)
( A d v a n c e
Valid Combinations
D0
E0
Package Type/
®
Technology
AHB, KHF
AHG, KHF
Material
I n f o r m a t i o n )
DDR Vendor
G, L, M
G, L
S72NS-R_00_05 May 9, 2008
Flash & DDR
Speed
0
Packing Type
0, 3
(Note 1)