ml22808 Oki Semiconductor, ml22808 Datasheet - Page 16

• Manufacturer Part Number: ml22808
• Description: Oki Adpcm Algorithm-based Speech Synthesis Lsi
• Manufacturer: Oki Semiconductor

PACKAGE DIMENSIONS
Notes for Mounting the Surface Mount Type Package
The surface mount type packages are very susceptible to heat in reflow mounting and humidity absorbed in
storage. Therefore, before you perform reflow mounting, contact OKI’s responsible sales person for the product
name, package name, pin number, package code and desired mounting conditions (reflow method, temperature
and times).
OKI Semiconductor
SSOP30-P-56-0.65-K
5
Mirror finish
Package material
Lead frame material
Pin treatment
Package weight (g)
Rev. No./Last Revised
ML22808/ML22804/ML22802-XXX
Epoxy resin
42 alloy
Solder plating (≥5µm)
0.19 TYP.
5/Dec. 5, 1996
FEDL2280XDIGEST-03
(Unit: mm)
16/18