hy27ug164g2m Hynix Semiconductor, hy27ug164g2m Datasheet

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hy27ug164g2m

Manufacturer Part Number
hy27ug164g2m
Description
4gbit 512mx8bit / 256mx16bit Nand Flash
Manufacturer
Hynix Semiconductor
Datasheet
Document Title
4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Memory
Revision History
Rev 0.7 / Feb. 2006
Revision
No.
0.0
0.1
0.2
0.3
0.4
Initial Draft.
1) Add Errata
1) Correct the Valid Blocks Number.
1) Add tRSBY (Table 11)
- tRSBY (Dummy Busy Time for Cache Read)
- tRSBY is 5us (typ.)
2) Edit Figure 18, 19
3) Correct Extended Read Status Register Commands (Table. 19)
1) Add ULGA Package.
- Figures & texts are added.
2) Correct the test Conditions (DC Characteristics table)
3) Change AC Conditions table
4) Add tWW parameter ( tWW = 100ns, min)
- Texts & Figures are added.
- tWW is added in AC timing characteristics table.
5) Edit System Interface Using CE don’t care Figures.
6) Correct Address Cycle Map.
Before
After VIN=VOUT=0 to Vcc (max)
Relaxed value
Specification
Before
After
Test Conditions (
VIN=VOUT=0 to 3.6V
Valid Blocks (max)
tWH
15
20
4,098
4,096
I
LI,
I
History
LO
)
4Gbit (512Mx8bit / 256Mx16bit) NAND Flash
tWP
25
35
tWC
50
60
HY27UG(08/16)4G(2/D)M Series
May. 13. 2005
May. 23. 2005
JUn. 14. 2005
Sep. 02. 2005
Jun. 13. 2005
Draft Date
Preliminary
Preliminary
Preliminary
Preliminary
Preliminary
Remark
1

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hy27ug164g2m Summary of contents

Page 1

Document Title 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Memory Revision History Revision No. 0.0 Initial Draft. 1) Add Errata 0.1 Specification Relaxed value 1) Correct the Valid Blocks Number. Valid Blocks (max) 0.2 Before After 1) Add tRSBY (Table 11) ...

Page 2

Revision History Revision No. 7) Correct PKG dimension (TSOP PKG) CP Before 0.050 After 0.100 8) Delete the 1.8V device’s features. 9) Change DC Characteristics (Table 8) - Operating Current I CC1 Typ Before 20 After 25 0.4 10) Change ...

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Revision History Revision No. 1) Correct tCS parameter in Autosleep tCS 0.7 Before 100ns (Min.) After 40ns (Min.) Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash History -Continued- Draft Date Remark Feb. 14. 2006 3 ...

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... Bytes x 64 Pages x 4,096 Blocks = (1K + 32) Words x 64 Pages x 4,096 Blocks PAGE SIZE - x8 device : ( spare) Bytes : HY27UG084G(2/D)M - x16 device : ( spare) Words : HY27UG164G2M BLOCK SIZE - x8 device: (128K + 4K spare) Bytes - x16 device: (64K + 2K spare) Words PAGE READ / PROGRAM - Random access: 30us (max.) - Sequential access: 50ns (min ...

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... This device includes also extra features like OTP/Unique ID area, Block Lock mechanism, Automatic Read at Power Up, Read ID2 extension. The HYNIX HY27UG(08/16)4G(2/D)M series is available TSOP1 mm, 52-ULGA mm. 1.1 Product List PART NUMBER HY27UG084G(2/D)M HY27UG164G2M Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash ORIZATION VCC RANGE x8 2 ...

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IO8 - IO15 IO7 - IO0 CLE ALE R/B Vcc Vss NC PRE Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure1: Logic Diagram Data Input / Outputs (x16 only) Data ...

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Figure 2. 48TSOP1 Contactions, x8 and x16 Device Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash 7 ...

Page 8

Figure 3. 52-ULGA Contactions, x8 Device, Dual interface Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash (Top view through package) 8 ...

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PIN DESCRIPTION Pin Name DATA INPUTS/OUTPUTS The IO pins allow to input command, address and data and to output data during read / program IO0-IO7 operations. The inputs are latched on the rising edge of Write Enable (WE). The ...

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IO0 1st Cycle A0 2nd Cycle A8 3rd Cycle A12 4th Cycle A20 5th Cycle A28 NOTE must be set to Low. IO0 1st Cycle A0 2nd Cycle A8 3rd Cycle A12 4th Cycle A20 5th Cycle A28 ...

Page 11

CLE ALE ( NOTE: 1. With ...

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BUS OPERATION There are six standard bus operations that control the device. These are Command Input, Address Input, Data Input, Data Output, Write Protect, and Standby. Typically glitches less than Chip Enable, Write Enable and Read ...

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DEVICE OPERATION 3.1 Page Read. Upon initial device power up, the device defaults to Read mode. This operation is also initiated by writing 00h and 30h to the command register along with five address cycles. In two consecutive read ...

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Block Erase. The Erase operation is done on a block basis. Block address loading is accomplished in two cycles initiated by an Erase Setup command (60h). Only address A18 to A29 (X8) or A17 to A28 (X16) is valid ...

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Read ID. The device contains a product identification mode, initiated by writing 90h to the command register, followed by an address input of 00h. Four read cycles sequentially output the manufacturer code (ADh), and the device code and 00h(don’t ...

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Cache Read Cache read operation allows automatic download of consecutive pages the whole device. Immediately after 1st latency end, while user can start reading out data, device internally starts reading following page. Start address of 1st page ...

Page 17

OTHER FEATURES 4.1 Data Protection & Power On/Off Sequence. The device is designed to offer protection from any involuntary program/erase during power-transitions. An internal voltage detector disables all functions whenever Vcc is below about 2V(3.3V device). WP pin provides ...

Page 18

Unlock - Command Sequence: Unlock block Command (23h) + Start block address + Command (24h) + End block address. See Fig. 24. - Unlocked blocks can be programmed or erased unlocked block’s status can be changed to ...

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Parameter Symbol Valid Block Number Symbol Ambient Operating Temperature (Commercial Temperature Range) T Ambient Operating Temperature (Extended Temperature Range) A Ambient Operating Temperature (Industrial Temperature Range) T Temperature Under Bias BIAS T Storage Temperature STG (2) Input or Output Voltage ...

Page 20

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 4: Block Diagram 20 ...

Page 21

Parameter Sequential Read Operating Current Program Erase Stand-by Current (TTL) Stand-by Current (CMOS) Input Leakage Current Output Leakage Current Input High Voltage Input Low Voltage Output High Voltage Level Output Low Voltage Level Output Low Current (R/B) Table 8: DC ...

Page 22

Item Input / Output Capacitance Input Capacitance Table 10: Pin Capacitance (TA=25℃, F=1.0MHz) Parameter Program Time Dummy Busy Time for Cache Program Dummy Busy Time for Cache Read Dummy Busy Time for the Lock or Lock-tight Block Number of partial ...

Page 23

Parameter CLE Setup time CLE Hold time CE setup time CE hold time WE pulse width ALE setup time ALE hold time Data setup time Data hold time Write Cycle time WE High hold time ALE to Data Loading Time ...

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Page Block IO Program Erase 0 Pass / Fail Pass / Fail Ready/Busy Ready/Busy 6 Ready/Busy Ready/Busy 7 Write Protect Write Protect DEVICE IDENTIFIER BYTE 1st 2nd ...

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... Block Size 128K (Without Spare Area) 256K Reserved X8 Organization X16 Table 15: 4th Byte of Device Identifier Description Part Number Voltage HY27UG084G2M 3.3V HY27UG084GDM 3.3V HY27UG164G2M 3.3V Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash IO7 IO6 Bus Width Manufacture Code ...

Page 26

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Table 17: Lock Status Code Figure 5: Command Latch Cycle 26 ...

Page 27

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 6: Address Latch Cycle 27 ...

Page 28

Figure 8: Sequential Out Cycle after Read (CLE=L, WE=H, ALE=L) Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 7. Input Data Latch Cycle 28 ...

Page 29

Figure 10: Read1 Operation (Read One Page) Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 9: Status Read Cycle 29 ...

Page 30

Figure 11: Read1 Operation intercepted by CE Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash 30 ...

Page 31

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 12 : Random Data output 31 ...

Page 32

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 13: Page Program Operation 32 ...

Page 33

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 14 : Random Data In 33 ...

Page 34

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 15 : Copy Back Program 34 ...

Page 35

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 16 : Cache Program 35 ...

Page 36

Figure 17: Block Erase Operation (Erase One Block) Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 18: Read ID Operation 36 ...

Page 37

Figure 19: start address at page start :after 1st latency uninterrupted data flow Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash 37 ...

Page 38

Figure 20: exit from cache read in 5us when device internally is reading Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash 38 ...

Page 39

System Interface Using CE don’t care To simplify system interface, CE may be deasserted during data loading or sequential data-reading as shown below. So possible to connect NAND Flash to a microporcessor. The only function that was removed ...

Page 40

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 23: Lock Command Figure 24: Unlock Command Sequence 40 ...

Page 41

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 25: Lock Tight Command Figure 26: Lock Status Read Timing 41 ...

Page 42

Rev 0.7 / Feb. 2006 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 27: Automatic Read at Power On Figure 28: Reset Operation HY27UG(08/16)4G(2/D)M Series 42 ...

Page 43

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 29: Power On/Off Timing VTH = 2.5 Volt for 3.3 Volt Supply devices 43 ...

Page 44

Figure 30: Ready/Busy Pin electrical specifications Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash 44 ...

Page 45

Figure 32: page programming within a block Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 31: Lock/Unlock FSM Flow Cart 45 ...

Page 46

Bad Block Management Devices with Bad Blocks have the same quality level and the same AC and DC characteristics as devices where all the blocks are valid. A Bad Block does not affect the performance of valid blocks because it ...

Page 47

Write Protect Operation The Erase and Program Operations are automatically reset when WP goes Low (tWW = 100ns, min). The operations are enabled and disabled as follows (Figure 34~37) Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) ...

Page 48

Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit (512Mx8bit / 256Mx16bit) NAND Flash Figure 36: Enable Erasing Figure 37: Disable Erasing 48 ...

Page 49

APPENDIX : Extra Features 5.1 Automatic Page0 Read after Power Up The timing diagram related to this operation is shown in Fig. 27 Due to this functionality the CPU can directly download the boot loader from the first page ...

Page 50

Figure 38. 48-pin TSOP1 20mm, Package Outline Symbol alpha Table 19: 48-pin TSOP1 , 12 x 20mm, Package Mechanical Data Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series ...

Page 51

Figure 39. 52-ULGA 17mm, Package Outline Symbol CP1 CP2 Table 20: 52-ULGA 17mm, Package Mechanical Data Rev 0.7 / Feb. 2006 HY27UG(08/16)4G(2/D)M Series 4Gbit ...

Page 52

MARKING INFORMATION - ...

Page 53

Application Note 1. Power-on/off Sequence After power is on, the device starts an internal circuit initialization when the power supply voltage reaches a specific level. The device shows its internal initialization status with the Ready/Busy signal if initialization is on ...

Page 54

Automatic sleep mode for low power consumption The device provides the automatic sleep function for low power consumption. The device enters the automatic sleep mode by keeping CE at VIH level for 10us without any additional command input, and ...

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