74AUP2GU04GM,132 NXP Semiconductors, 74AUP2GU04GM,132 Datasheet
74AUP2GU04GM,132
Specifications of 74AUP2GU04GM,132
74AUP2GU04GM-H
935280001132
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74AUP2GU04GM,132 Summary of contents
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Low-power dual unbuffered inverter Rev. 3 — 10 November 2010 1. General description The 74AUP2GU04 provides two unbuffered inverting gates. This device ensures a very low static and dynamic power consumption across the entire V range from 0.8 V ...
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... NXP Semiconductors 4. Marking Table 2. Marking Type number 74AUP2GU04GW 74AUP2GU04GM 74AUP2GU04GF 74AUP2GU04GN 74AUP2GU04GS [1] The pin 1 indicator is located on the lower left corner of the device, below the marking code. 5. Functional diagram mnb106 Fig 1. Logic symbol 6. Pinning information 6.1 Pinning 74AUP2GU04 GND 001aad699 Fig 4. Pin configuration SOT363 ...
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... NXP Semiconductors 6.2 Pin description Table 3. Pin description Symbol Pin 1A 1 GND Functional description [1] Table 4. Function table Input [ HIGH voltage level LOW voltage level. 8. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors 9. Recommended operating conditions Table 6. Recommended operating conditions Symbol Parameter V supply voltage CC V input voltage I V output voltage O T ambient temperature amb Δt/ΔV input transition rise and fall rate 10. Static characteristics Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter = −40 °C to +85 °C T amb V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH V LOW-level output voltage OL I input leakage current I I supply current CC = − ...
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... NXP Semiconductors Table 7. Static characteristics At recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter V LOW-level output voltage OL I input leakage current I I supply current CC 11. Dynamic characteristics Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see ...
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... NXP Semiconductors Table 8. Dynamic characteristics Voltages are referenced to GND (ground = 0 V); for test circuit see Symbol Parameter Conditions propagation delay nA to nY; see propagation delay nA to nY; see pF and power dissipation MHz capacitance [1] All typical values are measured at nominal V [ the same as t and t ...
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... NXP Semiconductors 12. Waveforms Measurement points are given in Logic levels: V and Fig 7. The data input (nA) to output (nY) propagation delays Table 9. Measurement points Supply voltage Output 0.5 × 3.6 V Test data is given in Table Definitions for test circuit Load resistance Load capacitance including jig and probe capacitance. ...
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... NXP Semiconductors 13. Additional characteristics Δ -------- - Δ constant. O Fig 9. Test set-up for measuring forward transconductance = 25 °C. T amb Fig 10. Typical forward transconductance as a function of supply voltage 74AUP2GU04 Product data sheet R bias = 560 kΩ 0.47 μF input output kHz (mA/ All information provided in this document is subject to legal disclaimers. ...
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... NXP Semiconductors 14. Application information Some applications for the 74AUP2GU04 are: • Linear amplifier (see • Crystal oscillator (see Remark: All values given are typical values unless otherwise specified. Fig 11. Linear amplifier application Fig 12. Crystal oscillator application 74AUP2GU04 Product data sheet Figure ...
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... NXP Semiconductors 15. Package outline Plastic surface-mounted package; 6 leads y 6 pin 1 index DIMENSIONS (mm are the original dimensions UNIT max 1.1 0.30 0.25 mm 0.1 0.8 0.20 0.10 OUTLINE VERSION IEC SOT363 Fig 13. Package outline SOT363 (SC-88) 74AUP2GU04 Product data sheet scale 2.2 1.35 2 ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1. 6× (2) terminal 1 index area DIMENSIONS (mm are the original dimensions) ( UNIT b D max max 0.25 1.5 mm 0.5 0.04 0.17 1.4 Notes 1. Including plating thickness. 2. Can be visible in some manufacturing processes. ...
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... NXP Semiconductors XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 0 6× (1) terminal 1 index area DIMENSIONS (mm are the original dimensions UNIT b D max max 0.20 1.05 mm 0.5 0.04 0.12 0.95 Note 1. Can be visible in some manufacturing processes. OUTLINE VERSION IEC SOT891 Fig 15 ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 0.9 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 0.95 mm nom 0.15 0.90 min 0.12 0.85 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors XSON6: extremely thin small outline package; no leads; 6 terminals; body 1.0 x 1 (6×) terminal 1 index area Dimensions (1) Unit max 0.35 0.04 0.20 1.05 mm nom 0.15 1.00 min 0.12 0.95 Note 1. Including plating thickness. 2. Visible depending upon used manufacturing technology. ...
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... NXP Semiconductors 16. Abbreviations Table 11. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model 17. Revision history Table 12. Revision history Document ID Release date 74AUP2GU04 v.3 20101110 • Modifications: Added type number 74AUP2GU04GN (SOT1115/XSON6 package). ...
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... In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or ...
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... NXP Semiconductors Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 19. Contact information For more information, please visit: For sales office addresses, please send an email to: 74AUP2GU04 Product data sheet 18 ...
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... NXP Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 3 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 4 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 8 Limiting values Recommended operating conditions Static characteristics Dynamic characteristics . . . . . . . . . . . . . . . . . . 6 12 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 13 Additional characteristics ...