bc847bpdxv6 ON Semiconductor, bc847bpdxv6 Datasheet - Page 7

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bc847bpdxv6

Manufacturer Part Number
bc847bpdxv6
Description
General Purpose Dual Transistor
Manufacturer
ON Semiconductor
Datasheet

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6
1
e
−X−
D
5
2
4
3
b
0.08 (0.003)
−Y−
6 5 PL
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
M
BC847BPDXV6T1, BC847BPDXV6T5
X
Y
0.0531
1.35
A
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
http://onsemi.com
SOT−563, 6 LEAD
CASE 463A−01
H
C
L
0.0197
E
0.0118
0.5
ISSUE F
0.3
0.0394
1.0
7
0.0197
0.5
SCALE 20:1
0.0177
0.45
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
inches
mm
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD THICKNESS
IS THE MINIMUM THICKNESS OF BASE MATERIAL.
DIM
H
A
b
C
D
E
L
e
E
0.50
0.17
0.08
1.50
1.10
0.10
1.50
MIN
MILLIMETERS
0.5 BSC
NOM
0.55
0.22
0.12
1.60
1.20
0.20
1.60
MAX
0.60
0.27
0.18
1.70
1.30
0.30
1.70
0.020
0.007
0.003
0.059
0.043
0.004
0.059
MIN
0.02 BSC
INCHES
0.021
0.009
0.005
0.062
0.047
0.008
0.062
NOM
0.023
0.007
0.066
0.051
0.012
0.066
0.011
MAX

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