km416s4030b Samsung Semiconductor, Inc., km416s4030b Datasheet - Page 7

• Manufacturer Part Number: km416s4030b
• Description: Cmos Sdram
• Manufacturer: Samsung Semiconductor, Inc.

KM416S4030B
Notes :
DQ BUFFER OUTPUT DRIVE CHARACTERISTICS
AC CHARACTERISTICS
Notes :
CLK cycle time
CLK to valid
output delay
Output data
hold time
CLK high pulse width
CLK low pulse width
Input setup time
Input hold time
CLK to output in Low-Z
CLK to output
in Hi-Z
Output rise time
Output fall time
Output rise time
Output fall time
Parameter
1. Parameters depend on programmed CAS latency.
2. If clock rising time is longer than 1ns, (tr/2-0.5)ns should be added to the parameter.
3. Assumed input rise and fall time (tr & tf) = 1ns.
1. Output rise and fall time must be guaranteed across V
2. Rise time specification based on 0pF + 50
3. Fall time specification based on 0pF + 50
4. Measured into 50pF only, use these values to characterize to.
5. All measurements done with respect to V
If tr & tf is longer than 1ns, transient time compensation should be considered,
i.e., [(tr + tf)/2-1]ns should be added to the parameter.
Parameter
CAS latency=3
CAS latency=2
CAS latency=3
CAS latency=2
CAS latency=3
CAS latency=2
CAS latency=3
CAS latency=2
Symbol
trh
tfh
trh
tfh
(AC operating conditions unless otherwise noted)
Symbol
t
t
t
t
t
SAC
t
t
t
t
SLZ
SHZ
OH
CC
CH
SH
CL
SS
Measure in linear
region : 1.2V ~ 1.8V
Measure in linear
region : 1.2V ~ 1.8V
Measure in linear
region : 1.2V ~ 1.8V
Measure in linear
region : 1.2V ~ 1.8V
Condition
SS
Min
12
8
3
3
3
3
2
1
1
.
to V
to V
-8
DD
1000
SS
Max
, use these values to design to.
6
6
6
6
, use these values to design to.
DD
and process range.
Min
10
10
3
3
3
3
2
1
1
1.37
1.30
Min
2.8
2.0
-H
1000
Max
6
6
6
6
Min
Typ
3.9
2.9
10
12
3
3
3
3
2
1
1
-L
1000
Max
6
7
6
7
Max
4.37
3.8
5.6
5.0
Min
3.5
3.5
2.5
10
13
3
3
1
1
-10
CMOS SDRAM
1000
Max
REV. 4 June '98
7
7
7
7
Volts/ns
Volts/ns
Volts/ns
Volts/ns
Unit
Unit
ns
ns
ns
ns
ns
ns
ns
ns
ns
Notes
1,2,3
1,2,3
Note
4
4
1,2
1
2
3
3
3
3
2