vn5770akp-e STMicroelectronics, vn5770akp-e Datasheet - Page 26

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vn5770akp-e

Manufacturer Part Number
vn5770akp-e
Description
Quad Smart Power Solid State Relay For Complete H-bridge Configurations
Manufacturer
STMicroelectronics
Datasheet

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Package and thermal data
26/34
Table 19.
1. values dependent on PCB heatsink area
Table 20.
1. Calculation is valid in any dynamic operating condition. Pd values set by user.
Figure 40. SO-28 HSD thermal impedance junction ambient single pulse
Z
Z
T
T
T
jHS12
jLS3
jLS4
thHSLS
thLSLS
ZTH
100
0.1
10
1
0.001
(˚C/W)
= Z
= Z
thLS3LS4
thHS12LS3
Single pulse thermal impedance definitions
Thermal calculations in transient mode
0.01
Z
Z
Z
thHS
thHSLS
thHSLS
= Z
thHS12LS4
x P
HSD
0.1
x P
x P
dHS12
Doc ID 17772 Rev 1
dHS12
dHS12
+ Z
Mutual thermal impedance junction to ambient
between high-side and low-side chips
Mutual thermal impedance junction to ambient
between low-side chips
time (sec)
+ Z
HsLsD
+ Z
thHSLS
1
thLS
thLSLS
x P
x (P
x P
dLS3
dLS3
10
dLS3
+ Z
+ P
(1)
+ Z
thLSLS
dLS4
thLS
(1)
) + T
100
x P
x P
dLS4
amb
dLS4
+ T
+ T
1000
amb
amb
VN5770AKP-E
Footprint
Footprint
1 cm
2 cm
1 cm
2 cm
6 cm
6 cm
2
2
2
2
2
2

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