vn5770akp-e STMicroelectronics, vn5770akp-e Datasheet - Page 25
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vn5770akp-e
Manufacturer Part Number
vn5770akp-e
Description
Quad Smart Power Solid State Relay For Complete H-bridge Configurations
Manufacturer
STMicroelectronics
Datasheet
1.VN5770AKP-E.pdf
(34 pages)
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
VN5770AKP-E
Manufacturer:
DIODES
Quantity:
36 000
Part Number:
VN5770AKP-E
Manufacturer:
ST
Quantity:
20 000
VN5770AKP-E
Figure 39. Auto and mutual Rthj-amb vs PCB copper area in open box free air
Table 17.
Table 18.
1. values dependent on PCB heatsink area
Table 19.
R
R
R
R
Z
Z
OFF
HS
ON
thHS
thLS
Note:
See
thHS
thLS
thHSLS
thLSLS
1
Figure
= Z
= R
OFF
= R
HS
ON
60
50
40
30
20
10
= R
= R
0
2
thLS3
Rth (˚C/W)
38. For more detailed information see
thLS3
thHS1
0
thLS3LS4
condition
Thermal calculations in clockwise and anti-clockwise operation in
steady-state mode
Thermal resistances definitions
Single pulse thermal impedance definitions
thHS1LS4
OFF
LS
ON
= Z
= R
3
= R
thLS4
thLS4
OFF
LS
thHS2
ON
= R
1
4
thHS2LS3
P
R
P
R
dHS1
dHS2
thHSLS
thHSLS
Doc ID 17772 Rev 1
x
x
2
R
R
Cu Area (refer to PCB layout)
+ T
+ T
T
thHS
thHS
jHS12
amb
amb
High-side chip thermal resistance junction to ambient
(HS
Low-side chip thermal resistance junction to ambient
Mutual thermal resistance junction to ambient between
high-side and low-side chips
Mutual thermal resistance junction to ambient between
low-side chips
High-side chip thermal impedance junction to ambient
Low-side chip thermal impedance junction to ambient
Table 17
+ P
+ P
1
dLS4
dLS3
or HS
3
and
x
x
(1)
Table
2
P
P
P
P
in ON-state)
dHS1
dLS4
dHS2
dLS3
18.
4
x
x
x
x
R
R
R
R
T
thLSLS
thLS
thHSLS
thHSLS
jLS3
(1)
+ T
5
+ T
Package and thermal data
+
+
amb
amb
RthA
RthB = RthC
RthAB = RthAC
RthBC
P
P
P
P
dHS1
dLS4
dHS2
dLS3
6
x
x
x
x
R
R
R
R
T
thLS
thLSLS
thHSLS
thHSLS
jLS4
7
+ T
+ T
+
+
amb
25/34
amb