lx1660 Microsemi Corporation, lx1660 Datasheet - Page 2

• Manufacturer Part Number: lx1660
• Description: Advanced Pwm Controller
• Manufacturer: Microsemi Corporation

LX1660/1661
2
Supply Voltage ............................................................................................................. 25V
Output Peak Current Source (500ns) ......................................................................... 1.5A
Output Peak Current Sink (500ns) ............................................................................. 1.5A
Analog Inputs ................................................................................................... -0.3 to +6V
Power Dissipation at T
Operating Junction Temperature
Storage Temperature Range .................................................................... -65°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ............................................................. 300°C
Note 1. Exceeding these ratings could cause damage to the device. All voltages are with respect
N PACKAGE:
D PACKAGE:
Junction Temperature Calculation: T
The
All of the above assume no ambient airflow
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
THERMAL RESISTANCE-JUNCTION TO AMBIENT,
N Package ............................................................................................................... 1.5W
D Package ........................................................................................................... 830mW
Plastic (N, D Packages) ......................................................................................... 150°C
JA
numbers are guidelines for the thermal performance of the device/pc-board system.
to Ground. Currents are positive into, negative out of the specified terminal. Pin
numbers refer to DIL packages only.
A B S O L U T E M A X I M U M R AT I N G S
A
= 25°C
T H E R M A L D ATA
P R O D U C T D A T A B O O K 1 9 9 6 / 1 9 9 7
J
= T
A
+ (P
P
A
R O D U C T I O N
D
D V A N C E D
x
JA
JA
JA
).
P W M C
(Note 1)
D
A T A
O N T R O L L E R
120°C/W
65°C/W
S
H E E T
NINV/SS
HICCUP
PACKAGE PIN OUTS
NINV/SS
SGND
HICCUP
OT
INV
SGND
V
EN
OT
ADJ
REF
C
INV
V
EN
T
ADJ
REF
C
T
N PACKAGE
D PACKAGE
(Top View)
(Top View)
2
3
4
5
6
7
8
1
2
3
4
5
6
7
8
1
16
15
14
13
12
11
10
16
15
14
13
12
11
10
9
9
V
TDRV
PGND
BDRV
V
SYNCEN
CS+
CS-
C1
CC
V
TDRV
PGND
BDRV
V
SYNCEN
CS+
CS-
Copyright © 1998
C1
CC
Rev. 1.1
7/98