at88rf256-12 ATMEL Corporation, at88rf256-12 Datasheet - Page 9

• Manufacturer Part Number: at88rf256-12
• Description: 125 Khz Rfid Transponder Chip
• Manufacturer: ATMEL Corporation

Mechanical Specifications
The chip contains two coil input pads with ESD protection
at levels greater than 2k volts along one end of the chip. All
remaining pads are for test purposes and use a different
structure and size, for which production bonding is not per-
mitted. ESD protection for these test pads is 300V.
The chip includes a 150 pF (±10%) tuning capacitor across
the coil input pins. In addition, parasitic capacitance will
range from 3 to 10 pF depending on voltage, processing
and temperature.
AT88RF256-12 Die Plot
GND
L2
TST
I/O
CLK
Size: X 1.488 mm
Y 1.873 mm
VCC
R/W
L1
Production units are shipped in full wafer form, with bad
dies marked with ink dots. Die size (shown on the Die Plot,
below left), is the offset from center to center on the wafer.
The actual sawn die size will be smaller based on the kerf
width. Wafer thickness is 20.5 mils, ±1.5 mils. Wafer diam-
eter is 6". Other production shipment forms may be
available for high-volume applications. Contact your local
Atmel sales office for details.
Bond Pad Locations (Center)
Bond Pad
GND
VCC
TST
CLK
R/W
I/O
L1
L2
-623
-619
-324
-217
623
293
607
-70
X
-812
-818
-818
-818
-816
-816
795
795
Y
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