mk50dn512zcll10 Freescale Semiconductor, Inc, mk50dn512zcll10 Datasheet - Page 33

• Manufacturer Part Number: mk50dn512zcll10
• Description: K50 Sub-family Data Sheet Supports The Following
• Manufacturer: Freescale Semiconductor, Inc

1. Maximum time based on expectations at cycling end-of-life.
6.4.1.2 Flash timing specifications — commands
1. Assumes 25MHz flash clock frequency.
2. Maximum times for erase parameters based on expectations at cycling end-of-life.
Freescale Semiconductor, Inc.
t
hversblk256k
t
t
t
pgmsec512
t
t
Symbol
Symbol
rd1blk256k
t
ersblk256k
t
t
t
t
t
t
pgmsec1k
pgmsec2k
t
t
rd1sec2k
pgmonce
swapx01
swapx02
swapx04
swapx08
hversscr
t
hvpgm4
pgmchk
t
t
t
t
t
rdonce
t
vfykey
ersscr
rdrsrc
pgm4
rd1all
ersall
Longword Program high-voltage time
Sector Erase high-voltage time
Erase Block high-voltage time for 256 KB
Read 1s Block execution time
Read 1s Section execution time (flash sector)
Program Check execution time
Read Resource execution time
Program Longword execution time
Erase Flash Block execution time
Erase Flash Sector execution time
Program Section execution time
Read 1s All Blocks execution time
Read Once execution time
Program Once execution time
Erase All Blocks execution time
Verify Backdoor Access Key execution time
Swap Control execution time
Description
Description
• 256 KB data flash
• 256 KB data flash
• 512 B flash
• 1 KB flash
• 2 KB flash
• control code 0x01
• control code 0x02
• control code 0x04
• control code 0x08
Table 20. NVM program/erase timing specifications
Table 21. Flash command timing specifications
K50 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Preliminary
Min.
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Peripheral operating requirements and behaviors
TBD
TBD
TBD
TBD
TBD
TBD
TBD
Typ.
Typ.
160
160
320
20
20
50
20
50
—
—
—
—
—
—
—
1600
Max.
TBD
Max.
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
100
800
800
100
1.4
2.8
40
35
35
35
35
Unit
Unit
ms
ms
ms
ms
ms
ms
ms
ms
ms
ms
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
μs
Notes
Notes
1
1
1
1
1
2
2
1
2
1
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