mk50dn512zcll10 Freescale Semiconductor, Inc, mk50dn512zcll10 Datasheet - Page 23

• Manufacturer Part Number: mk50dn512zcll10
• Description: K50 Sub-family Data Sheet Supports The Following
• Manufacturer: Freescale Semiconductor, Inc

1.
2.
3.
4.
6 Peripheral operating requirements and behaviors
All digital I/O switching characteristics assume:
6.1 Core modules
6.1.1 Debug trace timing specifications
Freescale Semiconductor, Inc.
1. output pins
2. input pins
Symbol
T
T
T
T
T
T
T
cyc
wh
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air), or EIA/JEDEC Standard JESD51-6, Integrated Circuit Thermal Test Method
Environmental Conditions—Forced Convection (Moving Air).
Determined according to JEDEC Standard JESD51-8, Integrated Circuit Thermal Test Method Environmental
Conditions—Junction-to-Board.
Determined according to Method 1012.1 of MIL-STD 883, Test Method Standard, Microcircuits, with the cold plate
temperature used for the case temperature. The value includes the thermal resistance of the interface material
between the top of the package and the cold plate.
Determined according to JEDEC Standard JESD51-2, Integrated Circuits Thermal Test Method Environmental
Conditions—Natural Convection (Still Air).
wl
s
h
r
f
• have C
• are configured for fast slew rate (PORTx_PCRn[SRE]=0), and
• are configured for high drive strength (PORTx_PCRn[DSE]=1)
• have their passive filter disabled (PORTx_PCRn[PFE]=0)
Clock period
Low pulse width
High pulse width
Clock and data rise time
Clock and data fall time
Data setup
Data hold
Description
L
=30pF loads,
K50 Sub-Family Data Sheet Data Sheet, Rev. 5, 5/2011.
Table 12. Debug trace operating behaviors
Preliminary
Peripheral operating requirements and behaviors
Frequency dependent
Min.
—
—
2
2
3
2
Max.
—
—
—
—
3
3
MHz
Unit
ns
ns
ns
ns
ns
ns
23