tea1118t NXP Semiconductors, tea1118t Datasheet - Page 17

• Manufacturer Part Number: tea1118t
• Description: Versatile Cordless Transmisssion Circuit
• Manufacturer: NXP Semiconductors

Philips Semiconductors
PACKAGE OUTLINES
1997 Jul 14
SSOP16: plastic shrink small outline package; 16 leads; body width 4.4 mm
Versatile cordless transmisssion circuit
DIMENSIONS (mm are the original dimensions)
Note
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT369-1
max.
1.5
A
0.15
0.00
A
16
1
1
Z
y
pin 1 index
A
1.4
1.2
2
IEC
e
0.25
A
3
D
0.32
0.20
b
p
0.25
0.13
b
JEDEC
p
c
9
8
REFERENCES
5.30
5.10
D
w
0
(1)
M
E
4.5
4.3
(1)
scale
EIAJ
c
0.65
2.5
17
e
A
2
H
6.6
6.2
E
A
1
5 mm
1.0
L
H
E
E
0.75
0.45
L
detail X
p
L
0.65
0.45
L
Q
p
Q
TEA1118; TEA1118A
PROJECTION
EUROPEAN
(A )
0.2
v
3
A
0.13
w
A
X
v
M
Product specification
0.1
A
y
ISSUE DATE
94-04-20
95-02-04
0.48
0.18
Z
(1)
SOT369-1
10
0
o
o