adg3308 Analog Devices, Inc., adg3308 Datasheet - Page 19

• Manufacturer Part Number: adg3308
• Description: Low Voltage 1.15 V To 5.5 V, Bidirectional, Logic Level Translators
• Manufacturer: Analog Devices, Inc.

OUTLINE DIMENSIONS
COPLANARITY
ORDERING GUIDE
Model
ADG3308BRUZ
ADG3308BRUZ-REEL
ADG3308BRUZ-REEL7
ADG3308BCPZ-REEL
ADG3308BCPZ-REEL7
ADG3308BCBZ-1-R2
ADG3308BCBZ-1-REEL
1
Z = Pb-free part.
0.15
0.05
PIN 1
0.10
Figure 42. 20-Lead Thin Shrink Small Outline Package [TSSOP]
20
1
BSC
0.65
0.30
0.19
1
COMPLIANT TO JEDEC STANDARDS MO-153-AC
IDENTIFIER
6.60
6.50
6.40
A1 BALL
1
1
1
1
1
Dimensions shown in millimeters
1
1.20 MAX
Temperature Range
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−40°C to +85°C
−25°C to +85°C
−25°C to +85°C
11
10
SEATING
PLANE
(RU-20)
(BALL SIDE DOWN)
4.50
4.40
4.30
TOP VIEW
0.20
0.09
2.06
2.00
1.94
6.40 BSC
8°
0°
Figure 44. 20-Ball Wafer Level Chip Scale Package [WLCSP]
Package Description
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Thin Shrink Small Outline Package [TSSOP]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
20-Ball Wafer Level Chip Scale Package [WLCSP]
20-Ball Wafer Level Chip Scale Package [WLCSP]
2.56
2.50
2.44
Dimensions shown in millimeters
Rev. A | Page 19 of 20
0.75
0.60
0.45
(CB-20-2)
INDICATOR
SEATING
PLANE
1.00
0.85
0.80
PIN 1
0.65
0.59
0.53
0.28
0.24
0.20
12° MAX
0.50 BSC
PITCH
Figure 43. 20-Lead Lead Frame Chip Scale Package [LFCSP_VQ]
0.50
BSC
BSC SQ
4.00
VIEW
COMPLIANT TO JEDEC STANDARDS MO-220-VGGD-1
TOP
0.36
0.32
0.28
0.80 MAX
0.65 TYP
REF
0.20
4 mm × 4 mm Body, Very Thin Quad
Dimensions shown in millimeters
BCS SQ
4
3.75
BOTTOM VIEW
(BALL SIDE UP)
0.05 MAX
0.02 NOM
3
(CP-20-1)
ADG3308/ADG3308-1
2
COPLANARITY
MAX
0.75
0.55
0.35
0.60
Package Option
RU-20
RU-20
RU-20
CP-20-1
CP-20-1
CB-20-2
CB-20-2
1
0.08
MAX
0.60
B
D
E
A
C
15
11
16
10
0.30
0.23
0.18
INDICATOR
20
6
PIN 1
5
1
0.25 MIN
2.25
2.10 SQ
1.95