tda1517atw-n1 NXP Semiconductors, tda1517atw-n1 Datasheet - Page 14

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tda1517atw-n1

Manufacturer Part Number
tda1517atw-n1
Description
8 W Btl Or 2 X 4 W Se Power Amplifier
Manufacturer
NXP Semiconductors
Datasheet
Philips Semiconductors
PACKAGE OUTLINE
2001 Apr 17
HTSSOP20: plastic, heatsink thin shrink small outline package; 20 leads; body width 4.4 mm
8 W BTL or 2
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
OUTLINE
VERSION
SOT527-1
max.
1.10
A
0.15
0.05
A 1
Z
20
1
0.95
0.80
y
A 2
IEC
4 W SE power amplifier
pin 1 index
0.25
A 3
heathsink side
e
0.30
0.19
b p
D h
D
0.20
0.09
c
JEDEC
D
b p
6.6
6.4
(1)
REFERENCES
0
11
10
D h
4.3
4.1
w
E h
M
E
4.5
4.3
(2)
scale
EIAJ
14
2.5
c
E h
3.1
2.9
A
2
0.65
A
e
1
5 mm
6.6
6.2
H E
H
1.0
E
E
L
detail X
0.75
0.50
L p
L
L
PROJECTION
EUROPEAN
p
0.2
v
A
(A )
3
0.13
TDA1517ATW
w
Product specification
X
v
A
0.1
M
y
ISSUE DATE
A
99-11-12
00-07-12
Z
0.5
0.2
(1)
SOT527-1
8
0
o
o

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