tda1517atw-n1 NXP Semiconductors, tda1517atw-n1 Datasheet - Page 10

• Manufacturer Part Number: tda1517atw-n1
• Description: 8 W Btl Or 2 X 4 W Se Power Amplifier
• Manufacturer: NXP Semiconductors

Philips Semiconductors
Thermal behaviour (PCB design considerations)
The typical thermal resistance [R
HTSSOP20 package is 37 K/W if the IC is soldered on a
printed-circuit board with double sided 35 m copper with
a minimum area of approximately 30 cm
usable thermal resistance depends strongly on the
mounting method of the device on the printed-circuit
board, the soldering method and the area and thickness of
the copper on the printed-circuit board.
The bottom ‘heat-spreader’ of the IC has to be soldered
efficiently on the ‘thermal land’ of the copper area of the
printed-circuit board using the re-flow solder technique.
A number of thermal vias in the ‘thermal land’ provide a
thermal path to the opposite copper site of the
printed-circuit board. The size of the surface layers should
be as large as needed to dissipate the heat.
2001 Apr 17
handbook, full pagewidth
8 W BTL or 2
R
L = 30 mm plus vias
th(j-p)
curve is given for practical calculation purpose.
Fig.5 Thermal resistance of the HTSSOP20 mounted on printed-circuit board.
4 W SE power amplifier
K/W
60
50
40
30
20
10
0
0
th(j-a)
] of the IC in the
2
. The actual
1
number of 35 m copper layers
2
R th(j-a)
R th(j-p)
10
3
The thermal vias (0.3 mm
not use web construction techniques, because those will
have high thermal resistance; continuous connection
completely around the via-hole is recommended.
For a maximum ambient temperature of 60 C the
following calculation can be made: for the application at
V
dissipation approximately 2.0 W;
T
Note: the above calculation holds for application at
‘average listening level’ music output signals. Applying (or
testing) with sine wave signals will produce approximately
twice the music power dissipation; at worst case condition
this can activate the maximum temperature protection.
j(max)
P
= 12 V and R
= T
4
amb
ON-BOARD-COOLING
+ P
COPPER DESIGN
L
CU-LAYER 2-4
CU-LAYER 1
= 8
R
th(j-a)
MGU306
the (ALL-) music power
L
L
= 60 C + 2.0
) in the ‘thermal land’ should
TDA1517ATW
Product specification
37 = 134 C.