uja1075 NXP Semiconductors, uja1075 Datasheet - Page 49
uja1075
Manufacturer Part Number
uja1075
Description
High-speed Can/lin Core System Basis Chip
Manufacturer
NXP Semiconductors
Datasheet
1.UJA1075.pdf
(53 pages)
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NXP Semiconductors
UJA1075_2
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
Fig 21. Temperature profiles for large and small components
temperature
MSL: Moisture Sensitivity Level
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 27 May 2010
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
High-speed CAN/LIN core system basis chip
temperature
peak
UJA1075
© NXP B.V. 2010. All rights reserved.
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