sc18is602 NXP Semiconductors, sc18is602 Datasheet - Page 15

no-image

sc18is602

Manufacturer Part Number
sc18is602
Description
Sc18is602/sc18is603 I?c-bus To Spi Bridge
Manufacturer
NXP Semiconductors
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
sc18is602BIPW
Manufacturer:
NXP
Quantity:
2 956
Part Number:
sc18is602BIPW
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
sc18is602BIPW,112
Manufacturer:
NXP
Quantity:
463
Part Number:
sc18is602BIPW,128
Manufacturer:
NXP/恩智浦
Quantity:
20 000
NXP Semiconductors
9. Limiting values
Table 11.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
SC18IS602_603_3
Product data sheet
Symbol
T
T
V
I
I
I
P
OH(I/O)
OL(I/O)
I/O(tot)(max)
amb(bias)
stg
n
tot
/pack
This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive
static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum.
Parameters are valid over the operating temperature range unless otherwise specified. All voltages are with respect to V
otherwise noted.
Based on package heat transfer, not device power consumption.
Limiting values
Parameter
bias ambient temperature
storage temperature
voltage on any other pin
HIGH-state output current per input/output pin
LOW-state output current per input/output pin
maximum total I/O current
total power dissipation per package
Rev. 03 — 13 August 2007
Conditions
operating
referenced to V
[1][2]
SS
[3]
SC18IS602/603
Min
-
-
-
-
55
65
0.5
I
2
C-bus to SPI bridge
Max
+125
+150
+5.5
8
20
120
1.5
© NXP B.V. 2007. All rights reserved.
SS
unless
Unit
V
mA
mA
mA
W
C
C
15 of 25

Related parts for sc18is602