mpc8306 Freescale Semiconductor, Inc, mpc8306 Datasheet - Page 48

• Manufacturer Part Number: mpc8306
• Description: Powerquicc Ii Pro Integrated Communications Processor Family Hardware Specifications
• Manufacturer: Freescale Semiconductor, Inc

Package and Pin Listings
21 Package and Pin Listings
This section details package parameters, pin assignments, and dimensions. The MPC8306 is available in
a thermally enhanced MAPBGA (mold array process-ball grid array); see
Parameters for the MPC8306,”
for information on the MAPBGA.
21.1
The package parameters are as provided in the following list.
21.2
48
MPC8306 PowerQUICC II Pro Integrated Communications Processor Family Hardware Specifications, Rev. 2
Package outline
Package Type
Interconnects
Pitch
Module height (typical)
Solder Balls
Ball diameter (typical)
The following figure shows the mechanical dimensions and bottom surface nomenclature of the
MPC8306, 369-MAPBGA package.
Package Parameters for the MPC8306
Mechanical Dimensions of the MPC8306 MAPBGA
and
Section 21.2, “Mechanical Dimensions of the MPC8306 MAPBGA,”
19 mm 19 mm
MAPBGA
369
0.80 mm
1.48 mm; Min = 1.31mm and Max 1.61mm
96 Sn / 3.5 Ag / 0.5 Cu (VM package)
0.40 mm
Section 21.1, “Package
Freescale Semiconductor