saf3560 NXP Semiconductors, saf3560 Datasheet - Page 15
saf3560
Manufacturer Part Number
saf3560
Description
Terrestial Digital Radio Processor
Manufacturer
NXP Semiconductors
Datasheet
1.SAF3560.pdf
(20 pages)
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Quantity
Price
NXP Semiconductors
10. Soldering
SAF3560_SDS_2
Product data sheet
Fig 5.
Footprint information for reflow soldering of HLQFP144 package
DIMENSIONS in mm
0.500
P1
0.560
Soldering footprint SOT612-4 (HLQFP144)
P2
23.300 23.300 20.300 20.300
Ax
Hy
solder land
solder paste
occupied area
Gy
Ay
C
Bx
By
1.500
Refer to the package outline drawing for actual layout
All information provided in this document is subject to legal disclaimers.
C
SLy
P2
D2 (8×)
0.280
D1
Rev. 02 — 3 May 2010
0.400 20.500 20.500 23.550 23.550
Generic footprint pattern
D2
nSPx
P1
Gx
SPx tot
SLx
Gx
Hx
Bx
Ax
Gy
SPx
(0.125)
Hx
nSPy
SPy
Hy
D1
4.500 4.500
SLx
Terrestial digital radio processor
SLy
SPx tot SPy tot
4.400
By
SAF3560
4.400
© NXP B.V. 2010. All rights reserved.
Ay
nSPx
0.750 0.750
4
SPx
SOT612-4
nSPy
SPy
4
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