epm2210gm100i Altera Corporation, epm2210gm100i Datasheet - Page 61

• Manufacturer Part Number: epm2210gm100i
• Description: Section I. Max Ii Device Family Data Sheet
• Manufacturer: Altera Corporation

Introduction
MAX II Hot-
Socketing
Specifications
Altera Corporation
December 2007
MII51004-2.0
MAX
swap, and power sequencing support. Designers can insert or remove a
MAX II board in a system during operation without undesirable effects to
the system bus. The hot socketing feature removes some of the difficulties
designers face when using components on printed circuit boards (PCBs)
that contain a mixture of 3.3-, 2.5-, 1.8-, and 1.5-V devices.
The MAX II device hot socketing feature provides:
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This chapter contains the following sections:
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MAX II devices offer all three of the features required for the
hot-socketing capability listed above without any external components or
special design requirements. The following are hot-socketing
specifications:
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Board or device insertion and removal
Support for any power-up sequence
Non-intrusive I/O buffers to system buses during hot insertion
“MAX II Hot-Socketing Specifications” on page 4–1
“Power-On Reset Circuitry” on page 4–6
The device can be driven before and during power-up or
power-down without any damage to the device itself.
I/O pins remain tri-stated during power-up. The device does not
drive out before or during power-up, thereby affecting other buses in
operation.
Signal pins do not drive the V
input signals to device I/O pins do not power the device V
V
I/O pins only if V
bank if the V
®
CCINT
II devices offer hot socketing, also known as hot plug-in or hot
power supplies via internal paths. This is true for all device
Chapter 4. Hot Socketing and
CCIO
CCINT
supply for that bank is held at GND.
Power-On Reset in MAX II
is held at GND. This is true for a particular I/O
CCIO
or V
CCINT
power supplies. External
Devices
CCIO
or
4–1