tda9150b NXP Semiconductors, tda9150b Datasheet - Page 31

• Manufacturer Part Number: tda9150b
• Description: Programmable Deflection Controller
• Manufacturer: NXP Semiconductors

Philips Semiconductors
PACKAGE OUTLINE
SOLDERING
Plastic dual in-line packages
B
The maximum permissible temperature of the solder is
260 C; this temperature must not be in contact with the
joint for more than 5 s. The total contact time of successive
solder waves must not exceed 5 s.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified storage maximum. If the printed-circuit board has
been pre-heated, forced cooling may be necessary
immediately after soldering to keep the temperature within
the permissible limit.
July 1994
Y DIP OR WAVE
Programmable deflection controller
Dimensions in mm.
3.60
3.05
max
2.0
20
1
Fig.21 Plastic dual in-line package; 20 leads (300 mil); DIP20, SOT146-1.
26.92
26.54
2.54
(9x)
1.73 max
0.53
31
max
R
Apply a low voltage soldering iron below the seating plane
(or not more than 2 mm above it). If its temperature is
below 300 C, it must not be in contact for more than 10 s;
if between 300 and 400 C, for not more than 5 s.
EPAIRING SOLDERED JOINTS
11
10
0.254 M
0.51
min
6.40
6.22
max
3.2
max
4.2
0.38 max
Preliminary specification
8.25
7.80
7.62
10.0
8.3
TDA9150B
MSA258