tda8954th NXP Semiconductors, tda8954th Datasheet - Page 9

• Manufacturer Part Number: tda8954th
• Description: 2 ? 210 W Class-d Power Amplifier
• Manufacturer: NXP Semiconductors

NXP Semiconductors
TDA8954_1
Product data sheet
8.4.1.1 Thermal FoldBack (TFB)
8.4.1 Thermal protection
8.4 Protection
The following protection circuits are incorporated into the TDA8954:
How the device reacts to a fault condition depends on which protection circuit has been
activated.
The TDA8954 employes an advanced thermal protection strategy. A TFB function
gradually reduces the output power within a defined temperature range. If the temperature
continues to rise, OTP is activated to shut the device down completely.
If the junction temperature (T
(T
the power dissipation, eventually stabilizing the temperature.
When T
LOW). Thermal foldback is activated if the temperature rises to T
The TFB warning signal is reset when the temperature drops below T
(see
•
•
•
•
•
act(th_fold)
Thermal protection:
– Thermal FoldBack (TFB)
– OverTemperature Protection (OTP)
OverCurrent Protection (OCP)
Window Protection (WP)
Supply voltage protection:
– UnderVoltage Protection (UVP)
– OverVoltage Protection (OVP)
– UnBalance Protection (UBP)
Clock Protection (CP)
Figure
j
reaches T
), the gain is gradually reduced. This reduces the output signal amplitude and
8).
act(warn)th_fold
Rev. 01 — 24 December 2009
j
) exceeds the thermal foldback activation threshold
, the TFB warning signal is activated (pin DIAG1 goes
2 × 210 W class-D power amplifier
act(th_fold)
rst(warn)th_fold
TDA8954
© NXP B.V. 2009. All rights reserved.
(see
Figure
again
9 of 46
7).