tda8954th NXP Semiconductors, tda8954th Datasheet - Page 43
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tda8954th
Manufacturer Part Number
tda8954th
Description
2 ? 210 W Class-d Power Amplifier
Manufacturer
NXP Semiconductors
Datasheet
1.TDA8954TH.pdf
(46 pages)
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Part Number:
TDA8954TH
Manufacturer:
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Part Number:
TDA8954TH
Manufacturer:
NXP/恩智浦
Quantity:
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NXP Semiconductors
TDA8954_1
Product data sheet
17.4 Package related soldering information
Table 15.
[1]
[2]
Package
CPGA, HCPGA
DBS, DIP, HDIP, RDBS, SDIP, SIL
PMFP
For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit
board.
For PMFP packages hot bar soldering or manual soldering is suitable.
[2]
Suitability of through-hole mount IC packages for dipping and wave soldering
Rev. 01 — 24 December 2009
Soldering method
Dipping
-
suitable
-
2 × 210 W class-D power amplifier
Wave
suitable
suitable
not suitable
TDA8954
© NXP B.V. 2009. All rights reserved.
[1]
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