tda8023 NXP Semiconductors, tda8023 Datasheet - Page 26

• Manufacturer Part Number: tda8023
• Description: Tda8023 Low Power Ic Card Interface
• Manufacturer: NXP Semiconductors

NXP Semiconductors
13. Package outline
Fig 10. Package outline SOT361-1 (TSSOP28)
TDA8023_1
Product data sheet
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
DIMENSIONS (mm are the original dimensions)
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
UNIT
mm
VERSION
OUTLINE
SOT361-1
max.
1.1
A
28
1
Z
y
0.15
0.05
A
1
pin 1 index
0.95
0.80
A
2
IEC
0.25
A
3
e
D
0.30
0.19
b
p
MO-153
JEDEC
0.2
0.1
c
REFERENCES
D
9.8
9.6
0
(1)
Rev. 01 — 16 July 2007
b
p
E
4.5
4.3
(2)
15
14
w
JEITA
scale
0.65
2.5
M
e
H
6.6
6.2
E
c
5 mm
A
L
1
2
A
1
0.75
0.50
L
p
0.4
0.3
Q
H
E
E
detail X
PROJECTION
EUROPEAN
Low power IC card interface
0.2
v
L
L
p
0.13
w
Q
A
(A )
TDA8023
0.1
3
© NXP B.V. 2007. All rights reserved.
y
ISSUE DATE
X
99-12-27
03-02-19
v
Z
0.8
0.5
A
M
(1)
SOT361-1
A
8
0
o
o
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