tda8025hn NXP Semiconductors, tda8025hn Datasheet - Page 22

• Manufacturer Part Number: tda8025hn
• Description: Ic Card Interface
• Manufacturer: NXP Semiconductors

NXP Semiconductors
9. Limiting values
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
10. Thermal characteristics
Table 7.
TDA8025_1
Product data sheet
Symbol
V
V
V
T
P
T
T
V
Symbol
R
stg
j
amb
DDI(REG)
DD(INTREGD)
I
tot
ESD
th(j-a)
Limiting values
Thermal characteristics
Parameter
thermal resistance from junction to ambient
Parameter
regulator input supply voltage
internal regulated supply voltage
input voltage
storage temperature
total power dissipation
junction temperature
ambient temperature
electrostatic discharge voltage
Remark: All card contacts are protected against any short-circuit to any other card
contact. Stress beyond the levels indicated in
the device. This is a short-term stress rating only and under no circumstances implies
functional operation under long-term stress conditions.
Rev. 01 — 6 April 2009
Conditions
pins CMDVCCN, TEST1, TEST2,
CLKDIV2, CLKDIV1, VCC_SEL1,
VCC_SEL2, CONFIG, RSTIN,
OFFN, TEST3, PORADJ, ENCLKIN,
XTAL2, XTAL1, I/OUC, AUX1UC and
AUX2UC
card contact pins PRES, PRESN,
I/O, RST, AUX1, AUX2 and CLK
T
pins I/O, RST, V
AUX2, PRES and PRESN; within
typical application
Human Body Model (HBM); all pins;
EIA/JESD22-A114-B, June 2000
Machine Model (MM); all pins;
EIA/JESD22-A115-A, October 1997
Charged Device Model (CDM);
amb
all pins, except corner pins
only corner pins (1, 8, 9, 16, 17,
24, 25 and 32)
= 25 C to +85 C
Conditions
with exposed pad soldered
without exposed pad soldered
CC
, AUX1, CLK,
Table 6
can cause permanent damage to
Min
-
-
0.3
0.3
0.3
0.3
55
25
6
2
200
500
750
TDA8025
© NXP B.V. 2009. All rights reserved.
IC card interface
Max
+5.5
+5.5
+5.5
+6.5
+150
0.56
150
+85
+6
+2
+200
+500
+750
Typ
42
62
Unit
K/W
K/W
22 of 38
Unit
V
V
V
V
W
kV
kV
V
V
V
C
C
C