pcf8535 NXP Semiconductors, pcf8535 Datasheet - Page 2

• Manufacturer Part Number: pcf8535
• Description: 65 X 133 Pixel Matrix Driver
• Manufacturer: NXP Semiconductors

Philips Semiconductors
CONTENTS
1
2
3
4
5
5.1
5.1.1
5.1.2
5.1.3
5.1.4
5.1.5
5.1.6
5.1.7
5.1.8
6
6.1
6.1.1
6.1.2
6.1.3
6.1.4
6.1.5
6.1.6
6.1.7
6.1.8
6.1.9
6.1.10
6.1.11
6.1.12
6.1.13
6.1.14
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.10.1
7.11
7.11.1
7.12
7.12.1
7.13
7.13.1
2001 Nov 07
65
133 pixel matrix driver
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
ORDERING INFORMATION
BLOCK DIAGRAM
Block diagram functions
Oscillator
Power-on reset
I
Input filters
Display data RAM
Timing generator
Address counter
Display address counter
PINNING
Pin functions
R0 to R64
C0 to C132
V
V
V
V
V
SDA
SDAOUT
SCL
SA0 and SA1
OSC
RES
T1, T2, T3, T4 and T5
FUNCTIONAL DESCRIPTION
Reset
Power-down
LCD supply voltage selector
Oscillator
Timing
Column driver outputs
Row driver outputs
Drive waveforms
Set multiplex rate
Bias system
Set bias system
Temperature measurement
Temperature read back
Temperature compensation
Temperature coefficients
V
Set V
2
C-bus controller
SS1
DD1
LCDOUT
LCDIN
LCDSENSE
OP
and V
to V
OP
value
DD3
SS2
2
7.14
7.14.1
7.15
7.15.1
7.15.1.1
7.15.1.2
7.15.1.3
7.15.1.4
7.15.1.5
7.15.2
7.15.2.1
7.15.2.2
7.15.2.3
7.15.2.4
7.15.2.5
7.16
7.16.1
7.16.2
7.16.2.1
7.16.2.2
7.16.2.3
7.16.2.4
7.16.2.5
7.16.3
7.16.4
7.16.5
7.16.6
7.17
7.17.1
7.17.2
8
9
10
11
12
13
13.1
14
15
16
17
18
19
20
21
Voltage multiplier control
S[1:0]
Addressing
Input addressing
Vertical addressing non-mirrored
Vertical addressing mirrored
Horizontal addressing non-mirrored
Horizontal addressing mirrored
Use of MX and MY bits
Output addressing
Mirror Y
Bottom Row Swap
Top Row Swap
Output row order
Interconnect possibilities using TRS and BRS
Instruction set
RAM read/write command page
Function and RAM command page
Command page
Function set
RAM page
Set Y address of RAM
Set X address of RAM
Display setting command page
HV-gen command page
Special feature command page
Instruction set
I
Characteristics of the I
I
LIMITING VALUES
HANDLING
DC CHARACTERISTICS
AC CHARACTERISTICS
RESET TIMING
APPLICATION INFORMATION
Application for chip-on-glass
BONDING PAD LOCATIONS
DEVICE PROTECTION
TRAY INFORMATION
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I
BARE DIE DISCLAIMER
2
2
C-bus interface
C-bus protocol
2
C-bus
Product specification
2
C COMPONENTS
PCF8535