74lvth322374 Fairchild Semiconductor, 74lvth322374 Datasheet

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74lvth322374

Manufacturer Part Number
74lvth322374
Description
Low Voltage 32-bit D-type Flip-flop With 3-state Outputs And 25 ?series Resistors In The Outputs Preliminary
Manufacturer
Fairchild Semiconductor
Datasheet

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© 2001 Fairchild Semiconductor Corporation
74LVTH322374GX
(Note 1)
74LVTH322374
Low Voltage 32-Bit D-Type Flip-Flop
with 3-STATE Outputs
and 25 Series Resistors in the Outputs (Preliminary)
General Description
The LVTH322374 contains thirty-two non-inverting D-type
flip-flops with 3-STATE outputs and is intended for bus ori-
ented applications. The device is byte controlled. A buff-
ered clock (CP) and Output Enable (OE) are common to
each byte and can be shorted together for full 32-bit opera-
tion.
The LVTH322374 is designed with equivalent 25
resistance in both the HIGH and LOW states of the output.
This design reduces line noise in applications such as
memory address drivers, clock drivers, and bus transceiv-
ers/transmitters.
The LVTH322374 data inputs include bushold, eliminating
the need for external pull-up resistors to hold unused
inputs.
These flip-flops are designed for low voltage (3.3V) V
applications, but with the capability to provide a TTL inter-
face to a 5V environment. The LVTH322374 is fabricated
with an advanced BiCMOS technology to achieve high
speed operation similar to 5V ABT while maintaining a low
power dissipation.
Ordering Code:
Note 1: BGA package available in Tape and Reel only.
Logic Symbol
Order Number
Package Number
(Preliminary)
BGA96A
96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide
[Tape and Reel]
DS500429
series
CC
Features
Input and output interface capability to systems at
5V V
Bushold data inputs eliminate the need for external pull-
up resistors to hold unused inputs
Live insertion/extraction permitted
Power Up/Power Down high impedance provides glitch-
free bus loading
Outputs include equivalent series resistance of 25
make external termination resistors unnecessary and
reduce overshoot and undershoot
ESD performance:
Human-body model
Machine model
Charged-device model
Packaged in plastic Fine-Pitch Ball Grid Array (FBGA)
(Preliminary)
CC
Package Description
200V
2000V
1000V
February 2001
Revised August 2001
www.fairchildsemi.com
Preliminary
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74lvth322374 Summary of contents

Page 1

... BiCMOS technology to achieve high speed operation similar to 5V ABT while maintaining a low power dissipation. Ordering Code: Order Number Package Number 74LVTH322374GX BGA96A 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide (Note 1) (Preliminary) [Tape and Reel] Note 1: BGA package available in Tape and Reel only. ...

Page 2

Connection Diagram (Top Thru View) Truth Tables Inputs – Inputs – ...

Page 3

Logic Diagrams V is associated with Bytes 1 and 2. CC1 V is associated with Bytes 3 and 4. CC2 Note: Please note that these diagrams are provided for the understanding of logic operation and should not be used to ...

Page 4

Absolute Maximum Ratings Symbol Parameter V Supply Voltage Input Voltage Output Voltage Input Diode Current Output Diode Current Output Current Supply Current ...

Page 5

DC Electrical Characteristics Symbol Parameter I Power Supply Current (V CCZ I Increase in Power Supply Current (V CC (Note 6) Note 4: An external driver must source at least the specified current to switch from LOW-to-HIGH. Note 5: An ...

Page 6

Physical Dimensions inches (millimeters) unless otherwise noted 96-Ball Fine-Pitch Ball Grid Array (FBGA), JEDEC MO-205, 5.5mm Wide Fairchild does not assume any responsibility for use of any circuitry described, no circuit patent licenses are implied and Fairchild reserves the right ...

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