ks8701 Samsung Semiconductor, Inc., ks8701 Datasheet - Page 11

• Manufacturer Part Number: ks8701
• Description: Flextm Roaming Decoder Ii
• Manufacturer: Samsung Semiconductor, Inc.

Introduction
MECHANICAL SPECIFICATION
PACKAGE DEMENSION
10
4X
NOTES:
1. ALL DIMENSIONING AND TOLERANCING CONFORM TO ANSI Y14.5- 1982.
2. DATUM PLANE
3. DATUMS
4. TO BE DETERMINED AT SEATING PLANE
5. DIMENSIONS D1 AND E1 DO NOT INCLUDE MOLD PROTRUSION, ALLOWABLE MOLD PROTRUSION IS 0.254mm ON
6. THESE DIMENSIONS TO BE DETERMINED AT DATUM PLANE
7. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION, ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08mm
8. CONTROLLING DIMENSION : MILLIMETER
9. A1 IS DEFINED AS THE DISTANCE FROM THE SEATING PLANE TO THE LOWEST POINT OF THE PACKAGE BODY.
5
6
TOTAL IN EXCESS OF THE b DIMENSION AT MAXIMUM MATERIAL CONDITION. DAMBAR CANNOT BE LOCATED ON
PLASTIC BODY AT BOTTOM OF PARTING LINE.
BODY AT DATUM PLANE
D1 AND E1 DIMENSIONS.
THE LOWER RADIUS OR THE FOOT.
N/4 TIPS
0.20 C A-B D
4X
E1
0.20 H A-B D
E1/2
- A -
A - B
3
0.05
AND
- H -
1
8
LOCATED AT MOLD PARTING LINE AND COINCIDENT WITH LEAD, WHERE LEAD EXITS
- D -
TO BE DETERMINED AT CENTERLINE BETWEEN LEADS WHERE LEADS EXIT PLASTIC
- H -
32
9
D1/2
8 PLACES
11/13
- D -
- C -
TOP VIEW
3
¡Æ
Figure 5 : 32-LQFP-0707 Package Dimension
5
D1
D
4
SEE DETAIL "A"
6
SEE DETAIL "C"
- H -
FLEX
D/2
TM
25
16
Roaming Decoder II
24
17
A
- B -
E/2
- H -
3
- C -
SEE DETAIL "B"
E
2
ccc
- 0.05 S
4
// 0.10 C
ddd M C A-B S D S
A2
A1
0.09/0.20
DATUM
PLANE
- H -
SYMBOL
1.00 REF.
0.20 MIN.
DETAIL "C"
0.08
R. MIN.
ddd
ccc
7
A1
A2
D1
E1
DETAIL "A"
b1
A
D
E
b
L
e
DETAIL "B"
MIN
0.05
1.35
0.45
0.30
0.30
b1
b
~
~
~
9.00 BSC
7.00 BSC
9.00 BSC
7.00 BSC
0.80 BSC
-A,B, OR D-
0.09/0.16
UNIT : mm
0¡ÆMIN
MAX
1.60
0.15
1.45
0.75
0.45
0.40
0.10
0.20
BASE METAL
WITH LEAD FINISH
e/2
3
e
0.08/0.20 R.
KS8701
0-7¡Æ
L
NOTE
9
4
6
4
6
7
0.25