mt46h16m16lf Micron Semiconductor Products, mt46h16m16lf Datasheet - Page 33

• Manufacturer Part Number: mt46h16m16lf
• Description: 256mb X16, X32 Mobile Ddr Sdram
• Manufacturer: Micron Semiconductor Products

Truncated READs
Figure 18:
PDF: 09005aef82091978 / Source: 09005aef8209195b
MT46H16M16LF__2.fm - Rev. H 3/08 EN
Command
Command
Address
Address
Terminating a READ Burst
DQS
DQS
CK#
CK#
DQ
DQ
CK
CK
Notes:
Note:
Bank a ,
Bank a ,
READ
READ
Col n
Col n
T0
T0
Data from any non-auto precharge READ burst may be truncated with a BURST TERMI-
NATE command, as shown in Figure 18. The BURST TERMINATE latency is equal to the
READ (CAS) latency; for example, the BURST TERMINATE command should be issued x
cycles after the READ command, where x equals the number of desired data element
pairs (pairs are required by the 2n-prefetch architecture).
Data from any non-auto precharge READ burst must be completed or truncated before a
subsequent WRITE command can be issued. If truncation is necessary, the BURST
TERMINATE command must be used, as shown in Figure 18. The
shown; the
are defined in the section on WRITEs.)
A READ burst may be followed by, or truncated with, a PRECHARGE command to the
same bank provided that auto precharge was not activated. The PRECHARGE command
should be issued x cycles after the READ command, where x equals the number of
desired data element pairs (pairs are required by the n-prefetch architecture). This is
shown in Figure 20 on page 35. Following the PRECHARGE command, a subsequent
command to the same bank cannot be issued until
1. D
2. BL = 4 or 8.
3. Shown with nominal
4. BST = BURST TERMINATE command; page remains open.
Part of the row precharge time is hidden during the access of the last data elements.
OUT
CL = 2
n = data-out from column n.
t
BST
DQSS (MAX) case has a longer bus idle time. (
BST
T1
T1
CL = 3
4
4
T1n
t
D
AC,
OUT
n
T2
NOP
NOP
T2
t
DQSCK, and
33
D
n+1
T2n
OUT
T2n
D
OUT
n
T3
T3
NOP
NOP
Micron Technology, Inc., reserves the right to change products or specifications without notice.
t
256Mb: x16, x32 Mobile DDR SDRAM
Transitioning data
DQSQ.
D
n+1
T3n
OUT
t
T4
T4
NOP
NOP
RP is met.
t
DQSS [MIN] and
©2005 Micron Technology, Inc. All rights reserved.
T5
T5
NOP
Don’t Care
NOP
t
DQSS (MIN) case is
Operations
t
DQSS [MAX]