mcf51em256 Freescale Semiconductor, Inc, mcf51em256 Datasheet - Page 44

no-image

mcf51em256

Manufacturer Part Number
mcf51em256
Description
Microcontrollers Covers Mcf51em256 Mcf51em128
Manufacturer
Freescale Semiconductor, Inc
Datasheet

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
mcf51em256CLK
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
Company:
Part Number:
mcf51em256CLK
Quantity:
49
Part Number:
mcf51em256CLL
Manufacturer:
FREESCALE
Quantity:
110
Part Number:
mcf51em256CLL
Manufacturer:
Freescale Semiconductor
Quantity:
10 000
1
2
3
4
5
Electrical Characteristics
2.16
Electromagnetic compatibility (EMC) performance is highly dependant on the environment in which the
MCU resides. Board design and layout, circuit topology choices, location and characteristics of external
components as well as MCU software operation all play a significant role in EMC performance. The
system designer should consult Freescale applications notes such as AN2321, AN1050, AN1263,
AN2764, and AN1259 for advice and guidance specifically targeted at optimizing EMC performance.
2.16.1
Microcontroller radiated RF emissions are measured from 150 kHz to 1 GHz using the TEM/GTEM Cell
method in accordance with the IEC 61967-2 and SAE J1752/3 standards. The measurement is performed
with the microcontroller installed on a custom EMC evaluation board while running specialized EMC test
software. The radiated emissions from the microcontroller are measured in a TEM cell in two package
orientations (North and East). For more detailed information concerning the evaluation results, conditions
and setup, please refer to the EMC Evaluation Report for this device.
44
10
12
11
The frequency of this clock is controlled by a software setting.
These values are hardware state machine controlled. User code does not need to count cycles. This information supplied for
calculating approximate time to program and erase.
The program and erase currents are additional to the standard run I
V
Typical endurance for flash was evaluated for this product family on the HC9S12Dx64. For additional information on how
Freescale defines typical endurance, please refer to Engineering Bulletin EB619, Typical Endurance for Nonvolatile Memory.
Typical data retention values are based on intrinsic capability of the technology measured at high temperature and de-rated
to 25°C using the Arrhenius equation. For additional information on how Freescale defines typical data retention, please refer
to Engineering Bulletin EB618, Typical Data Retention for Nonvolatile Memory.
N
1
2
3
4
5
6
7
8
9
DD
= 3.0 V, bus frequency = 4.0 MHz.
C
D
D
D
D
P
P
P
P
C
C
EMC Performance
Supply voltage for program/erase
–40 °C to 85 °C
Supply voltage for read operation
Internal FCLK frequency
Internal FCLK period (1/f
Longword program time (random location)
Longword program time (burst mode)
Page erase time
Mass erase time
Longword program current
Page erase current
Program/erase endurance
Data retention
Radiated Emissions
T
T = 25 °C
L
to T
H
= –40 °C to 85 °C
5
Characteristic
MCF51EM256 Series ColdFire Microcontroller Data Sheet, Rev.3
2
2
3
Preliminary—Subject to Change Without Notice
1
FCLK
4
3
)
Table 23. Flash Characteristics
2
2
V
Symbol
prog/erase
R
R
V
f
t
t
t
t
t
t
FCLK
IDDBP
IDDPE
D_ret
Burst
Page
Mass
Fcyc
prog
Read
DD
. These values are measured at room temperatures with
10,000
Min
150
1.8
1.8
15
5
100,000
Typical
20,000
4000
100
9.7
7.6
9
4
Freescale Semiconductor
Max
6.67
200
3.6
3.6
cycles
years
Unit
t
t
t
t
kHz
mA
mA
Fcyc
Fcyc
Fcyc
Fcyc
μs
V
V

Related parts for mcf51em256