cha2411-qdg United Monolithic Semiconductors, cha2411-qdg Datasheet - Page 9

• Manufacturer Part Number: cha2411-qdg
• Description: 20-25ghz Low Noise Amplifier
• Manufacturer: United Monolithic Semiconductors

20-25GHz Low Noise Amplifier
ESD sensitivity
MIL-STD-1686C
ESD STM5.1-2001
Package Information
Parameter
Package body material
Lead finish
MSL Rating
Recommended surface mount package assembly(see UMS AN0017)
For volume production the SMD type package can be treated as a standard surface mount component
(please refer to the IPC/JEDEC J-STD-020C standard or equivalent). The assembly on the motherboard
can be performed using a standard assembly process (e.g. stencil solder printing, standard pick-and-
place machinery, and solder reflow oven). However, caution should be taken to perform a good and
reliable contact over the whole pad area.
Caution
The solder thickness after reflow should be typical 50µm [2 mils] and the lateral alignment between the
package and the motherboard should be within 50µm [2 mils].
It is important for the performance of the product that the whole overlapping area between the
motherboard and package pads is connected. Voids or other improper connections, in particular,
between the ground pads on motherboard and package will lead to a deterioration of the RF
performance and the heat dissipation. The latter effect can reduce drastically reliability and lifetime of the
product.
Ref. : DSCHA2411-QDG8333 - 28 Nov 08
Route Départementale 128 , B.P.46 - 91401 ORSAY Cedex - FRANCE
300
280
260
240
220
200
180
160
140
120
100
80
60
40
20
Tel.: [phone] - Fax : [phone]
0
0
Standard
255
217
150
20
40
MAXIMUM RECOMMENDED REFLOW PROFILE for LEADFREE SMT ASSEMBLY PRODUCTS
60
80
Maximum Ramp up rate : 3° C / second
100
120
RoHS-compliant Low stress Injection Molded Plastic
100% matte Sn
MSL1
HBM Class 1 (<0V - 1999V)
HBM Class 0 (<250V)
140
9/10
160
Time (s)
180
200
220
Specifications subject to change without notice
240
30s Max
260
Value
CHA2411-QDG
280
300
320
340
360