asmt-mw62-ngj00 Avago Technologies, asmt-mw62-ngj00 Datasheet - Page 5

• Manufacturer Part Number: asmt-mw62-ngj00
• Manufacturer: Avago Technologies

Figure 7. Maximum forward current vs. ambient temperature. Derated
based on T
Figure 9. Recommended Reflow Soldering
Flux Bin Limit
Tolerance for each bin limits is ±10%
5
Bin
G
H
J
K
L
180
150
120
90
60
30
0
217 °C
200 °C
150 °C
0
JMAX
= 145°C, Rθ JA = 100°C/W, 120°C/W and 140°C/W
20
[1]
3 °C/SEC. MAX.
3 °C/SEC. MAX.
60 - 120 SEC.
Rθ
Rθ
Rθ
Flux (lm) at 150mA
Min
25.5
33
43
56
73
(For reference only) [X
255 - 260 °C
J-A
J-A
J-A
=140°C/W
=120°C/W
=100°C/W
40
AMBIENT TEMPERATURE, T
60
TIME
80
100
1
10 to 30 SEC.
100 SEC. MAX.
(Acc. to J-STD-020C)
Max
33
43
56
73
95
X
-6°C/SEC. MAX.
2
A
]
- °C
120
140
160
Figure 8. Maximum Forward Current vs. Metal Slug Temperature. Derated
based on T
Figure 10. Recommended soldering land pattern
17.00 ± 0.20
180
150
120
90
60
30
0
0
JMAX
= 145°C, Rθ
20
10.70 ± 0.10
5.08 ± 0.10
40
AMBIENT TEMPERATURE, T
J-MS
1.00 ± 0.10
Rθ
= 27°C/W.
60
J-MS
= 27°C/W
80
100
8.40 ± 0.10
3.1 ± 0.10
A
- °C
120
140
160