SGA-8343X Stanford Microdevices, SGA-8343X Datasheet - Page 5

• Manufacturer Part Number: SGA-8343X
• Description: Reliability Qualification Report
• Manufacturer: Stanford Microdevices

Test Conditions
Number of
Devices Under
Test
Test Conditions
Number of
Devices Under
Test
Test Conditions
Number of
Devices Under
Test
Test Conditions
Number of
Devices Under
Test
Test Conditions
Number of
Devices Under
Test
Group A1a
Group A1b
Group A2
Group B
Group C
SGA-8343X Reliability Qualification Report
Temperature Cycling (Air to Air Thermal Shock) – Soldered on PCB
Temperature Range -65°C to 165°C, 10 min dwell, 1 minute transition,
1000 cycles
Temperature Cycling (Air to Air Thermal Shock)
Temperature Range -65°C to 165°C, 10 min dwell, 1 minute transition,
1000 cycles
25
High Temperature Operating Life Test
Junction Temperature = 150°C, Test Duration = 1000 hours
80
HAST
Temperature = 110°C, 85% Relative Humidity, Test Duration = 264 hours
15
Autoclave
Temperature = 121°C, Relative Humidity = 100%, Test Duration = 96
hours
17
40
(1)
Test
Standard
Test
Standard
Test
Standard
Test
Standard
Test
Standard
JESD22-
A104(B)
JESD22-
A104(B)
JESD22-
A108(B)
JESD22-
A110(B)
JESD22-
A102(C)
Results
Results
Results
Results
Results
PASS
Pass
PASS
PASS
PASS