SC18IS603 NXP Semiconductors, SC18IS603 Datasheet - Page 22

• Manufacturer Part Number: SC18IS603
• Description: I2C-bus to SPI bridge
• Manufacturer: NXP Semiconductors

NXP Semiconductors
14. Abbreviations
SC18IS602_602B_603_4
Product data sheet
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description” .
Table 16.
Acronym
CDM
CPU
EEPROM
ESD
GPIO
HBM
I/O
I
LSB
MM
MSB
SPI
2
Fig 24. Temperature profiles for large and small components
C-bus
temperature
MSL: Moisture Sensitivity Level
Abbreviations
Description
Charged Device Model
Central Processing Unit
Electrically Erasable Programmable Read-Only Memory
ElectroStatic Discharge
General Purpose Input/Output
Human Body Model
Input/Output
Inter-Integrated Circuit bus
Least Significant Bit
Machine Model
Most Significant Bit
Serial Peripheral Interface
Rev. 04 — 11 March 2008
= minimum soldering temperature
maximum peak temperature
minimum peak temperature
= MSL limit, damage level
SC18IS602/602B/603
temperature
peak
I
2
C-bus to SPI bridge
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