74LVT574PW,118 NXP Semiconductors, 74LVT574PW,118 Datasheet - Page 2

IC OCTAL D TRANSP F-F 20TSSOP

74LVT574PW,118

Manufacturer Part Number
74LVT574PW,118
Description
IC OCTAL D TRANSP F-F 20TSSOP
Manufacturer
NXP Semiconductors
Series
74LVTr
Type
D-Type Busr
Datasheet

Specifications of 74LVT574PW,118

Package / Case
20-TSSOP
Function
Standard
Output Type
Tri-State Non Inverted
Number Of Elements
1
Number Of Bits Per Element
8
Frequency - Clock
150MHz
Delay Time - Propagation
3.6ns
Trigger Type
Positive Edge
Current - Output High, Low
32mA, 64mA
Voltage - Supply
2.7 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Number Of Circuits
1
Logic Family
LVT
Logic Type
D-Type Edge Triggered Flip-Flop
Polarity
Non-Inverting
Input Type
Single-Ended
Propagation Delay Time
4.3 ns at 3.3 V
High Level Output Current
- 32 mA
Supply Voltage (max)
3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Minimum Operating Temperature
- 40 C
Supply Voltage (min)
2.7 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
568-4634-2
74LVT574PW-T
74LVT574PW-T
935176370118

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
74LVT574PW,118
Quantity:
533
NXP Semiconductors
3. Ordering information
Table 1.
4. Functional diagram
74LVT_LVTH574_4
Product data sheet
Type number
74LVT574D
74LVTH574D
74LVT574DB
74LVTH574DB
74LVT574PW
74LVTH574PW
74LVT574BQ
Fig 1.
Fig 3.
CP
OE
Logic symbol
Logic diagram
Ordering information
D0
D
CP Q
Package
Temperature range Name
40 C to +85 C
40 C to +85 C
40 C to +85 C
40 C to +85 C
2
3
4
5
6
7
8
9
Q0
D0
D1
D2
D3
D4
D5
D6
D7
D1
D
CP Q
OE
CP
11
1
Q0
Q1
Q2
Q3
Q4
Q5
Q6
Q7
mna798
Q1
19
18
17
16
15
14
13
12
D2
SO20
SSOP20
TSSOP20
DHVQFN20
D
CP Q
Rev. 04 — 11 September 2008
Q2
D3
D
CP Q
Description
plastic small outline package; 20 leads;
body width 7.5 mm
plastic shrink small outline package; 20 leads;
body width 5.3 mm
plastic thin shrink small outline package; 20 leads;
body width 4.4 mm
plastic dual in-line compatible thermal enhanced very
thin quad flat package; no leads; 20 terminals;
body 2.5
Fig 2.
Q3
D4
4.5
D
CP Q
74LVT574; 74LVTH574
IEC logic symbol
0.85 mm
Q4
D5
11
2
3
4
5
6
7
8
9
1
D
CP Q
3.3 V octal D-type flip-flop; 3-state
EN2
1D
C1
Q5
001aae466
D6
2
D
CP Q
19
18
17
16
15
14
13
12
© NXP B.V. 2008. All rights reserved.
Q6
D7
D
CP Q
Version
SOT163-1
SOT339-1
SOT360-1
SOT764-1
001aae467
Q7
2 of 16

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