AD9639 Analog Devices, Inc., AD9639 Datasheet - Page 8

• Manufacturer Part Number: AD9639
• Description: Quad, 12-bit, 170 Msps/210 Msps Serial Output 1.8 V Adc
• Manufacturer: Analog Devices, Inc.

AD9639
ABSOLUTE MAXIMUM RATINGS
Table 5.
Parameter
AVDD to AGND
DRVDD to DRGND
AGND to DRGND
AVDD to DRVDD
DOUT + x/DOUT − x to DRGND
SDO, SDI/SDIO, CLK±, VIN ± x, VCM x,
SCLK, CSB, PGMx, RESET, PDWN
Storage Temperature Range
Operating Temperature Range
Lead Temperature (Soldering, 10 sec)
Junction Temperature
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
TEMPOUT, RBIAS to AGND
to AGND
Rating
−0.3 V to +2.0 V
−0.3 V to +2.0 V
−0.3 V to +0.3 V
−2.0 V to +2.0 V
−0.3 V to DRVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−0.3 V to AVDD + 0.3 V
−65°C to +125°C
−40°C to +85°C
300°C
150°C
Rev. 0 | Page 8 of 36
THERMAL RESISTANCE
The exposed paddle must be soldered to the ground plane for the
LFCSP package. Soldering the exposed paddle to the printed
circuit board (PCB) increases the reliability of the solder joints,
maximizing the thermal capability of the package.
Table 6. Thermal Resistance
Package Type
72-Lead LFCSP (CP-72-3)
Typical θ
still air. Airflow increases heat dissipation, effectively reducing
θ
from metal traces, through holes, ground, and power planes
reduces θ
ESD CAUTION
JA
. In addition, metal in direct contact with the package leads
JA
JA
, θ
.
JB
, and θ
JC
values are specified for a 4-layer board in
θ
16.2
JA
θ
7.9
JB
θ
0.6
JC
Unit
°C/W