BU9889GUL-W Rohm, BU9889GUL-W Datasheet - Page 16

• Manufacturer Part Number: BU9889GUL-W
• Description: WL-CSP EEPROM family I2C BUS
• Manufacturer: Rohm

●Low voltage malfunction prevention function
●Vcc noise countermeasures
●Cautions on use
© 2010 ROHM Co., Ltd. All rights reserved.
BU9889GUL-W
www.rohm.com
(1)Described numeric values and data are design representative values, and the values are not guaranteed.
(2)We believe that application circuit examples are recommendable, however, in actual use, confirm characteristics further
(3)Absolute maximum ratings
(4)GND electric potential
(5)Terminal design
(6)Terminal to terminal shortcircuit and wrong packaging
(7)Use in a strong electromagnetic field may cause malfunction, therefore, evaluate design sufficiently.
LVCC circuit prevents data rewrite action at low power, and prevents wrong write.
At LVCC voltage (Typ. =1.2V) or below, it prevent data rewrite.
○ Bypass capacitor
When noise or surge gets in the power source line, malfunction may occur, therefore, for removing these, it is recommended
to attach a bypass capacitor (0.1µF) between IC Vcc and GND. At that moment, attach it as close to IC as possible.
And, it is also recommended to attach a bypass capacitor between board Vcc and GND.
sufficiently. In the case of use by changing the fixed number of external parts, make your decision with sufficient margin in
consideration of static characteristics and transition characteristics and fluctuations of external parts and our LSI.
If the absolute maximum ratings such as impressed voltage and action temperature range and so forth are exceeded, LSI
may be destructed. Do not impress voltage and temperature exceeding the absolute maximum ratings. In the case of fear
exceeding the absolute maximum ratings, take physical safety countermeasures such as fuses, and see to it that
conditions exceeding the absolute maximum ratings should not be impressed to LSI.
Set the voltage of GND terminal lowest at any action condition. Make sure that each terminal voltage is lower than that of
GND terminal.
In consideration of permissible loss in actual use condition, carry out heat design with sufficient margin.
When to package LSI onto a board, pay sufficient attention to LSI direction and displacement. Wrong packaging may
destruct LSI. And in the case of shortcircuit between LSI terminals and terminals and power source, terminal and GND
owing to foreign matter, LSI may be destructed.
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2010.01 - Rev.A
Technical Note