PBSS304NX NXP Semiconductors, PBSS304NX Datasheet - Page 11

• Manufacturer Part Number: PBSS304NX
• Description: NPN low VCEsat Breakthrough In Small Signal (BISS) transistor
• Manufacturer: NXP Semiconductors

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NXP Semiconductors
11. Soldering
PBSS304NX_2
Product data sheet
Fig 16. Reflow soldering footprint
Fig 17. Wave soldering footprint
4.60
0.85
SOT89 standard mounting conditions for reflow soldering
Not recommended for wave soldering
1.20
1.20
1.00
0.20
(3x)
1.50
3
Rev. 02 — 20 November 2009
6.60
2.40
0.70
5.30
3
3.70
1.90
1.20
3.95
4.75
2.25
2.00
2
1
2
0.50
60 V, 4.7 A NPN low V
1.20
3.50
3.00
1
0.60 (3x)
0.70 (3x)
7.60
0.50
preferred transport direction during soldering
1.20
1.70
4.85
Dimensions in mm
msa442
PBSS304NX
CEsat
solder lands
solder resist
occupied area
Dimensions in mm
© NXP B.V. 2009. All rights reserved.
(BISS) transistor
solder lands
solder resist
occupied area
solder paste
msa423
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