BFU630F NXP Semiconductors, BFU630F Datasheet - Page 3

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BFU630F

Manufacturer Part Number
BFU630F
Description
NPN wideband silicon RF transistor
Manufacturer
NXP Semiconductors
Datasheet
www.DataSheet.co.kr
NXP Semiconductors
4. Marking
5. Limiting values
6. Thermal characteristics
BFU630F
Product data sheet
Table 4.
Table 5.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
Table 6.
Type number
BFU630F
Symbol
V
V
V
I
P
T
T
Symbol
R
C
Fig 1.
stg
j
CBO
CEO
EBO
tot
th(j-sp)
T
sp
is the temperature at the solder point of the emitter lead.
Power derating curve
Marking
Limiting values
Thermal characteristics
Parameter
thermal resistance from junction to solder point
Parameter
collector-base voltage
collector-emitter voltage
emitter-base voltage
collector current
total power dissipation
storage temperature
junction temperature
All information provided in this document is subject to legal disclaimers.
(mW)
Rev. 1 — 15 December 2010
P
tot
300
250
200
150
100
50
0
0
Marking
D2*
40
Conditions
open emitter
open base
open collector
T
sp
 90 C
80
NPN wideband silicon RF transistor
120
T
001aam812
[1]
sp
(°C)
-
-
Min
-
-
-
-
65
Description
* = p : made in Hong Kong
* = t : made in Malaysia
* = w : made in China
160
Conditions
Max
16
5.5
2.5
30
200
+150
150
BFU630F
© NXP B.V. 2010. All rights reserved.
Typ
300
Unit
V
V
V
mA
mW
C
C
Unit
K/W
3 of 12
Datasheet pdf - http://www.DataSheet4U.net/

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