SSD1859 Solomon Systech, SSD1859 Datasheet - Page 7

• Manufacturer Part Number: SSD1859
• Description: 128 x 80 STN LCD Segment / Common 4 G/S Drive
• Manufacturer: Solomon Systech

5. DIE PAD ARRANGEMENT (SSD1859Z DIE PIN ASSIGNMENT)
SSD1859
SEG117
SEG118
SEG119
SEG120
SEG121
SEG122
SEG123
SEG124
SEG125
SEG126
SEG127
COM30
COM29
COM28
COM27
COM26
COM25
COM40
COM41
COM42
COM43
COM66
COM67
COM68
COM69
COM70
COM71
ICONS
COM3
COM2
COM1
COM0
SEG0
SEG1
SEG2
SEG3
SEG4
SEG5
SEG6
NC
141
334
Rev 1.0
345
130
P 7/48
129
1
Figure 2 - SSD1859 Die Pad Floor Plan
Dec 2003
NC
NC
NC
VR
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VOUT
VL5
VL4
VL3
VL2
VSS
INTRS
VDD
CXP
CXN
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
CVSS
RVSS
VLref
VLref
VLref
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VCI
VDD
VDD
VDD
VDD
VDD
VDD
VDD
VDD
NC
NC
D7
D7
D6
D6
D5
D4
D3
D2
D1
D0
VDD
E(RD)
E(RD)
R/W
R/W
VSS
D/C
D/C
D/C
/RES
VDD
/CS
/CS
VSS
PS1
VDD
VSS
PS0
VDD
EN80
VSS
CL
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
PIN #1
Die Size: 10915um x 1015um
Die Thickness: 21mil
Bump Height: Typical 18µm
Bump coplanarity <3µm (within die)
Bump Size:
25
25
Note:
100
1.
2.
3.
4.
100
25
25
Pad 1-129:
Pad 130-140,335-345:
Pad 142-333:
Pad 141, 334:
The gold bumps face up in this
diagram.
Coordinates reference to center of the
chip.
All dimensions and coordinates in um.
All alignment keys do not contain gold
bump.
25
25
25
25
25
25
50
100
100
56 x 56um
82 x 36um
36 x 82um
56 x 82um
Solomon Systech
www.DataSheet4U.com
100
75
18
100