TC1017 Microchip Technology, TC1017 Datasheet - Page 14

• Manufacturer Part Number: TC1017
• Description: Tiny CMOS LDO
• Manufacturer: Microchip Technology

TC1017
FIGURE 5-3:
Ambient Temperature (SOT-23 Package).
FIGURE 5-4:
Ambient Temperature (SOT-23 Package).
DS21813B-page 14
700
600
500
400
300
200
100
160
140
120
100
80
60
40
20
0
0
-40
-40
-15
-15
Ambient Temperature (°C)
Ambient Temperature (°C)
10
10
Power Dissipation vs.
Maximum Current vs.
35
35
V
IN
- V
60
60
OUT
= 1V
85
85
110
110
5.4
The primary path for heat conduction out of the SC-70
or SOT-23 package is through the package leads.
Using heavy wide traces at the pads of the device will
facilitate the removal of the heat within the package,
thus lowering the thermal resistance R
the thermal resistance, the maximum internal power
dissipation capability of the package is increased.
FIGURE 5-5:
Layout.
Layout Considerations
C
V
1
IN
SC-70 Package Suggested
GND
2003 Microchip Technology Inc.
SHDN
U1
V
OUT
C
2
JA
. By lowering