Si8800EDB Vishay Siliconix, Si8800EDB Datasheet - Page 7

• Manufacturer Part Number: Si8800EDB
• Description: N-Channel 20 V (D-S) MOSFET
• Manufacturer: Vishay Siliconix

PACKAGE OUTLINE
MICRO FOOT 0.8 mm x 0.8 mm: 4-BUMP (2 x 2, 0.4 mm PITCH)
Notes (Unless otherwise specified):
1. All dimensions are in millimeters.
2. Four (4) solder bumps are lead (Pb)-free 95.5Sn/3.5Ag/0.7Cu with diameter Ø 0.165 mm to Ø 0.185 mm.
3. Backside surface is coated with a Ti/Ni/Ag layer.
4. Non-solder mask defined copper landing pad.
5.
Notes:
a. Use millimeters as the primary measurement.
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?66700.
Document Number: 66700
S10-1046-Rev. A, 03-May-10
·
is location of pin 1.
Dim.
A
A
A
D
b
e
s
1
2
0.314
0.127
0.187
0.165
0.180
0.760
Min.
Mark on Backside of die
2
1
800
Recommended Land
XXX
e
Millimeters
Nom.
0.357
0.157
0.200
0.175
0.400
0.200
0.800
3
4
4 x Ø 0.205 to 0.225 Note 4
Solder Mask ~ Ø 0.215
a
0.400
0.187
0.213
0.185
0.220
0.840
Max.
4 x Ø b
0.0124
0.0050
0.0074
0.0064
0.0070
0.0299
Min.
s
D
S
D
e
S
G
Inches
0.0141
0.0062
0.0079
0.0068
0.0157
0.0078
0.0314
Nom.
Vishay Siliconix
Si8800EDB
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0.0157
0.0074
0.0084
0.0072
0.0086
0.0330
Max.
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