BAS16VV-BAS16VY NXP Semiconductors, BAS16VV-BAS16VY Datasheet - Page 3

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BAS16VV-BAS16VY

Manufacturer Part Number
BAS16VV-BAS16VY
Description
Bas16vv; Bas16vy Triple High-speed Switching Diodes
Manufacturer
NXP Semiconductors
Datasheet
NXP Semiconductors
5. Limiting values
6. Thermal characteristics
BAS16VV_BAS16VY_3
Product data sheet
Table 6.
In accordance with the Absolute Maximum Rating System (IEC 60134).
[1]
[2]
[3]
Table 7.
[1]
[2]
[3]
[4]
Symbol
Per diode
V
V
I
I
I
P
Per device
T
T
T
Symbol
Per diode
R
R
F
FRM
FSM
j
amb
stg
RRM
R
tot
th(j-a)
th(j-sp)
T
Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
Soldering points at pins 4, 5 and 6.
Reflow soldering is the only recommended soldering method.
Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm
Soldering points at pins 4, 5 and 6.
j
= 25 C prior to surge.
Limiting values
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
thermal resistance from
junction to solder point
Parameter
repetitive peak reverse voltage
reverse voltage
forward current
repetitive peak forward current
non-repetitive peak forward
current
total power dissipation
junction temperature
ambient temperature
storage temperature
BAS16VV
BAS16VY
BAS16VV
BAS16VY
Rev. 03 — 20 April 2007
Conditions
in free air
Conditions
square wave
T
T
BAS16VV; BAS16VY
amb
sp
t
t
t
p
p
p
= 85 C
= 1 s
= 1 ms
= 1 s
25 C
Triple high-speed switching diodes
[1]
[2]
[3]
[4]
Min
-
-
-
[1]
[2]
[3]
Min
-
-
-
-
-
-
-
-
-
-
65
65
Typ
-
-
-
© NXP B.V. 2007. All rights reserved.
Max
100
100
200
450
4.5
1
0.5
180
250
150
+150
+150
Max
700
410
260
2
Unit
V
V
mA
mA
A
A
A
mW
mW
.
C
C
C
Unit
K/W
K/W
K/W
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