AD6426 Analog Devices, AD6426 Datasheet - Page 32
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AD6426
Manufacturer Part Number
AD6426
Description
Enhanced GSM Processor
Manufacturer
Analog Devices
Datasheet
1.AD6426.pdf
(50 pages)
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Note:
The input impedance of the clock buffer is a function of the voltage and waveform of the clock input signal. For sinusoidal input
signals the typical input impedance can be calculated by: R
VDD to GND ............................................. -0.3V to + TBD V
Digital I/O Voltage to GND ...................-0.3V to VDD + 0.3V
Operating Temperature Range ........................ -25°C to +85°C
LQFP Package
Storage Temperature Range .......................... -65°C to +150°C
Maximum Junction Temperature ................................ +150°C
Q
Lead temperature, Soldering
Note:
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress rating only and functional
operation of the device at these or any other conditions above those listed in the operational sections is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability. T
ESD SUSCEPTIBILITY
This Information applies to a product under development. Its characteristics and specifications are subject to change without notice. Analog Devices assumes no
obligation regarding future manufacture unless otherwise agreed to in writing. No responsibility is assumed by Analog Devices for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent
rights of Analog Devices.
Revision Preliminary 2.3 (June 9, ´98)
Preliminary Technical Information
SPECIFICATIONS
Parameter
T
V
I
I
f
V
R
Logic Inputs
Logic Outputs
JA
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 volts, which
readily accumulate on the human body and on test equipment, can discharge without detection.
Although this device features proprietary ESD protection circuitry, permanent damage may still occur
on this device if it is subjected to high energy electrostatic discharges. Therefore, proper precautions
are recommended to avoid any performance degradation or loss of functionality.
DD
DD
CLKIN
A
CLKIN
DD
CLKIN
Thermal Impedance..............................................28°C/W
Vapor Phase (60 sec)........................................... +215°C
Infrared (15 sec).................................................. +220°C
, Ambient Operating Temperature
V
V
I
C
V
V
I
I
, Supply Current (Idle Mode)
, Supply Current (Talk Mode)
IH
OZL
OZH
, Supply Voltage
IN
IH
IL
OH
OL
, Clock Input Frequency
, I
, Clock Input Resistance (see Note)
, Clock Input Voltage
, Input Low Voltage
, Input Capacitance
, Input High Voltage
, Low Level Output 3-State Leakage Current
, Output Low Voltage
, Output High Voltage
, High Level Output 3-State Leakage Current
IL
Input Current
ABSOLUTE MAXIMUM RATINGS
A
= +25°C unless otherwise stated.
IN
V
V
[k ] = V
DD
DD
0.250
Min
-25
-10
-10
-10
2.4
- 32 -
- 0.8
- 0.4
CLKIN
PBGA Package
Storage Temperature Range .......................... -65°C to +150°C
Maximum Junction Temperature ................................ +150°C
Q
Lead temperature, Soldering
TBD
TBD
TBD
Typ
JA
19.5
13
[V
Thermal Impedance..............................................30°C/W
Vapor Phase (60 sec)........................................... +215°C
Infrared (15 sec).................................................. +220°C
PP
]
78
Max
+85
3.3
0.8
0.4
10
10
10
Units
MHz
Volt
Volt
Volt
mA
mA
V
k
pF
°C
A
A
A
PP
Confidential Information
Comments
sine wave, ac-coupled
sine wave, ac-coupled
@ V
@ V
WARNING!
DD
DD
= 3.0 V
= 3.0 V
ESD SENSITIVE DEVICE
AD6426
General