EK43501-01 Peregrine Semiconductor Corp., EK43501-01 Datasheet - Page 5

• Manufacturer Part Number: EK43501-01
• Description: Specifications: Type: Attenuator ; Supplied Contents: Board ; For Use With/Related Products: PE43501 ; Frequency: 9kHz ~ 6GHz ; Lead Free Status: Lead Free ; RoHS Status: RoHS Compliant
• Manufacturer: Peregrine Semiconductor Corp.

PE43501
Product Specification
Figure 18. Pin Configuration (Top View)
Table 2. Pin Descriptions
Note: Ground C0.25, C0.5, C1 C2, C4, if not in use.
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GND
GND
GND
RF1
19, 20, 26,
5, 6, 8-17,
P/S
V
NC
Pin No.
A0
DD
Paddle
27
18
21
22
23
24
25
28
29
30
31
32
1
2
3
4
7
1
2
3
4
5
6
7
8
32
9
31
10
Pin Name
C0.25 (D0)
C0.5 (D1)
C4 (D4)
C2 (D3)
C1 (D2)
30
Solder pad
11
GND
GND
Exposed
RF1
RF2
CLK
N/C
P̅
V
A0
A2
A1
LE
SI
/ S
DD
29
12
28
13
27
14
No Connect
Power supply pin
Serial/Parallel mode select
Address bit A0 connection
Ground
RF1 port
RF2 port
Address bit A2 connection
Address bit A1 connection
Serial interface Latch Enable input
Serial interface Clock input
Serial interface Data input
Parallel control bit, 4 dB
Parallel control bit, 2 dB
Parallel control bit, 1 dB
Parallel control bit, 0.5 dB
Parallel control bit, 0.25 dB
Ground for proper operation
26
15
25
16
24
23
22
21
20
19
18
17
Description
CLK
LE
A1
A2
GND
GND
RF2
GND
Electrostatic Discharge (ESD) Precautions
When handling this UltraCMOS™ device, observe the
same precautions that you would use with other ESD-
sensitive devices. Although this device contains
circuitry to protect it from damage due to ESD,
precautions should be taken to avoid exceeding the
specified rating.
Latch-Up Avoidance
Unlike conventional CMOS devices, UltraCMOS™
devices are immune to latch-up.
Moisture Sensitivity Level
The Moisture Sensitivity Level rating for the PE43501 in
the 32-lead 5x5 QFN package is MSL1.
Switching Frequency
The PE43501 has a maximum 25 kHz switching rate.
Switching rate is defined to be the speed at which the
DSA can be toggled across attenuation states.
Exposed Solder Pad Connection
The exposed solder pad on the bottom of the package
must be grounded for proper device operation.
©2008-2009 Peregrine Semiconductor Corp. All rights reserved.
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