BGA7024 Philips Semiconductors (Acquired by NXP), BGA7024 Datasheet - Page 2

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BGA7024

Manufacturer Part Number
BGA7024
Description
Manufacturer
Philips Semiconductors (Acquired by NXP)
Datasheet
NXP Semiconductors
2. Pinning information
3. Ordering information
4. Functional diagram
BGA7024_1
Product data sheet
Table 2.
[1]
[2]
Table 3.
Pin
1
2
3
Type number
BGA7024
Fig 1.
This pin is DC-coupled and requires an external DC-blocking capacitor.
The center metal base of the SOT89 also functions as heatsink for the power amplifier.
Functional diagram
RF_IN
Pinning
Ordering information
V
GND
RF_IN
Description
CC(RF)
All information provided in this document is subject to legal disclaimers.
Package
Name
-
3
Description
plastic surface-mounted package; exposed die pad for good
heat transfer; 3 leads
Rev. 01 — 28 May 2010
ENABLE
BIAS
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
BANDGAP
[1]
[2]
[1]
Simplified outline
CONVERTER
3
V/I
2
1
014aab020
2
GND
BGA7024
Graphic symbol
1
© NXP B.V. 2010. All rights reserved.
3
V
CC(RF)
2
Version
SOT89
sym130
2 of 23
1

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