BGA7024 Philips Semiconductors (Acquired by NXP), BGA7024 Datasheet

no-image

BGA7024

Manufacturer Part Number
BGA7024
Description
Manufacturer
Philips Semiconductors (Acquired by NXP)
Datasheet
1. Product profile
1.1 General description
1.2 Features and benefits
1.3 Applications
1.4 Quick reference data
The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount
package. It delivers 24 dBm output power at 1 dB gain compression and superior
performance up to 2700 MHz.
Table 1.
Input and output impedances matched to 50
unless otherwise specified.
[1]
[2]
Symbol Parameter
I
f
G
P
IP3
CC
L(1dB)
p
BGA7024
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
Rev. 01 — 28 May 2010
400 MHz to 2700 MHz frequency operating range
16 dB small signal gain at 2 GHz
24 dBm output power at 1 dB gain compression
Integrated active biasing
External matching allows broad application optimization of the electrical performance
5 V single supply operation
All pins ESD protected
Broadband CPE/MoCA
WLAN/ISM/RFID
Wireless infrastructure (base station,
repeater, point-to-point backhaul systems)
O
Operation outside this range is possible but not guaranteed.
P
L
= 11 dBm per tone; spacing = 1 MHz.
supply current
frequency
power gain
output power at 1 dB gain compression
output third-order intercept point
Quick reference data
Ω
. Typical values at V
Conditions
f = 2140 MHz
f = 2140 MHz
f = 2140 MHz
Industrial applications
E-metering
Satellite Master Antenna TV (SMATV)
CC
= 5 V; T
[1]
[2]
Min
95
400
13.5 15
24.0 25.5 -
35.0 38.5 -
Product data sheet
case
Typ
110
-
= 25
Max
125
2700 MHz
16.5
°
C;
Unit
mA
dB
dBm
dBm

Related parts for BGA7024

BGA7024 Summary of contents

Page 1

... MHz to 2700 MHz 0.25 W high linearity silicon amplifier Rev. 01 — 28 May 2010 1. Product profile 1.1 General description The BGA7024 MMIC is a one-stage amplifier, available in a low-cost surface-mount package. It delivers 24 dBm output power gain compression and superior performance up to 2700 MHz. 1.2 Features and benefits ...

Page 2

... Package Name Description - plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads BIAS BANDGAP ENABLE 3 RF_IN Functional diagram All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 Simplified outline Graphic symbol [1] [ V/I CONVERTER 1 V ...

Page 3

... Characteristics Parameter supply voltage supply current Dynamic characteristics information”; unless otherwise specified. frequency power gain output power gain compression All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 Min - - − Conditions = 85 ° ...

Page 4

... All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 Ω . Typical values Conditions Min [ 940 MHz - [ 1960 MHz - [ 2140 MHz 35.0 38 2445 MHz - [ 940 MHz - [ 1960 MHz - [ 2140 MHz ...

Page 5

... Reliability according to JESD85; confidence level activation energy = 0.7 eV; acceleration factor according to Arrhenius equation Moisture sensitivity level All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 S 22 Angle Magnitude Angle (degree) (ratio) (degree) 41.89 0.65 161.2 41.65 0.66 160.8 41.7 0.66 160.5 41.61 0.66 160.5 41.59 0.67 160.9 41 ...

Page 6

... G p (dB (1) ( 0.95 0.96 f (GHz) (1) T (2) T (3) T Fig 4. All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 MSL4 MSL5 (1) (2) (3) 0.92 0.93 0.94 0.95 = −40 °C. case = 25 °C. case = 85 °C. ...

Page 7

... MSL2 MSL3 MSL4 All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 (2) (3) (1) 0.92 0.93 0.94 0.95 = −40 °C. case = 25 °C. case = 85 °C. case Output third-order intercept point as a function ...

Page 8

... RO4003C MSL3 RF_IN V CC(RF) BGA7024 = 3.38; copper thickness = 35 μm. r All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 Function Remarks DC blocking Murata GRM1885C1H680JA01D input match Murata GRM1885C1H3R9CZ01D input match Murata GRM1885C1H3R9CZ01D output match Murata GRM1885C1H3R9CZ01D RF decoupling Murata GRM1885C1H680JA01D ...

Page 9

... T case = 25 °C. (2) T case = 85 °C. (3) T case 42 IP3 O (dBm) 40 (1) ( 1.93 1.95 1.97 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case of frequency BGA7024 014aab029 1.99 f (GHz) 014aab031 1.99 f (GHz) © NXP B.V. 2010. All rights reserved ...

Page 10

... MSL3 C5 MSL5 L1 C1 MSL2 All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 J2 MSL6 C4 MSL7 out 014aab032 © NXP B.V. 2010. All rights reserved ...

Page 11

... MSL3 RF_IN V CC(RF) C2 BGA7024 = 3.38; copper thickness = 35 μm. r All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 Remarks Murata GRM1885C1H150JA01D Murata GRM1885C1H2R4CZ01D Murata GRM1885C1H1R5CZ01D Emerson Network Power 142-0701-841 MOLEX Tyco Electronics 36501J022JTDG - - - - - - - Multicomp MC 0.063W 0603 0R ...

Page 12

... T case = 25 °C. (2) T case = 85 °C. (3) T case 42 IP3 O (dBm 2.11 2.13 2.15 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case of frequency BGA7024 014aab035 2.17 f (GHz) 014aab037 (1) (2) (3) 2.17 f (GHz) © NXP B.V. 2010. All rights reserved ...

Page 13

... MSL3 C5 MSL5 L1 C1 MSL2 All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 J2 MSL6 C4 MSL7 out 014aab038 © NXP B.V. 2010. All rights reserved ...

Page 14

... DC decoupling AVX 1206ZG106ZAT2A - Emerson Network Power 142-0701-841 - MOLEX DC feed Tyco Electronics 36501J022JTDG - input match - input match - output match - output match - output match - - - Multicomp MC 0.063W 0603 MSL4 MSL5 MSL6 C4 C3 BGA7024 50 Ω MSL7 J2 014aab039 © NXP B.V. 2010. All rights reserved ...

Page 15

... T case = 85 °C. (3) T case 42 IP3 O (dBm) 40 (2) 38 (3) ( 2.405 2.425 2.445 = −40 °C. (1) T case = 25 °C. (2) T case = 85 °C. (3) T case of frequency BGA7024 014aab041 2.465 2.485 f (GHz) 014aab043 2.465 2.485 f (GHz) © NXP B.V. 2010. All rights reserved ...

Page 16

... C6 MSL4 MSL3 MSL2 All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 J3 J2 MSL5 MSL6 C4 MSL7 out 014aab044 © NXP B.V. 2010. All rights reserved. ...

Page 17

... RO4003C All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 Function Remarks DC blocking Murata GRM1885C1H150JA01D input match Murata GRM1885C1H1R5CZ01D output match Murata GRM1885C1H1R8CZ01D ...

Page 18

... MHz to 2700 MHz 0.25 W high linearity silicon amplifier through via analog routing RO4003C dielectric constant ε = 3.38. r All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 35 μm (1 oz.) copper + 0.3 μm gold plating RO4003C, 0.51 mm (20 mil) 35 μm (1 oz.) copper (1) 0 mil) 35 μm (1 oz.) copper FR4, 0. mil) 35 μ ...

Page 19

... 0.44 4.6 2.6 4.25 3.0 1.5 0.23 4.4 2.4 3.75 REFERENCES JEDEC JEITA TO-243 SC-62 All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 1.2 0.13 0.8 EUROPEAN ISSUE DATE PROJECTION 06-03-16 06-08-29 © NXP B.V. 2010. All rights reserved. SOT89 ...

Page 20

... BGA7024_1 Product data sheet 400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier Data sheet status Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 Change notice Supersedes - - © NXP B.V. 2010. All rights reserved ...

Page 21

... Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 © NXP B.V. 2010. All rights reserved ...

Page 22

... NXP Semiconductors’ product specifications. 16.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. http://www.nxp.com salesaddresses@nxp.com All information provided in this document is subject to legal disclaimers. Rev. 01 — 28 May 2010 BGA7024 © NXP B.V. 2010. All rights reserved ...

Page 23

... Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2010. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com BGA7024 All rights reserved. Date of release: 28 May 2010 Document identifier: BGA7024_1 ...

Related keywords