BGA7024 Philips Semiconductors (Acquired by NXP), BGA7024 Datasheet - Page 19

• Manufacturer Part Number: BGA7024
• Manufacturer: Philips Semiconductors (Acquired by NXP)

NXP Semiconductors
13. Package outline
Fig 27. Package outline SOT89
BGA7024_1
Product data sheet
Plastic surface-mounted package; exposed die pad for good heat transfer; 3 leads
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT89
1.6
1.4
A
0.48
0.35
b p1
b p2
0.53
0.40
w
M
IEC
B
b p3
1.8
1.4
0.44
0.23
1
c
b
e
p1
1
All information provided in this document is subject to legal disclaimers.
TO-243
JEDEC
4.6
4.4
D
0
b
D
p3
e
REFERENCES
2
2.6
2.4
Rev. 01 — 28 May 2010
E
b
p2
400 MHz to 2700 MHz 0.25 W high linearity silicon amplifier
3.0
e
SC-62
scale
JEITA
2
3
1.5
e 1
L
B
A
E
p
4.25
3.75
H E
1.2
0.8
4 mm
L p
0.13
w
PROJECTION
EUROPEAN
c
H
E
BGA7024
© NXP B.V. 2010. All rights reserved.
ISSUE DATE
06-03-16
06-08-29
SOT89
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