SMARTCARD STMicroelectronics, SMARTCARD Datasheet - Page 2

• Manufacturer Part Number: SMARTCARD
• Description: Ordering Information For Package And Delivery
• Manufacturer: STMicroelectronics

SMARTCARD MCU
Table 4. Ordering Information Scheme
Note: *where “y” indicates the sawing orientation as shown in Figure 2
Figure 2. Sawing orientation
Sawn wafers are scribed and mounted in a frame
on adhesive tape. The orientation is defined by the
position of the GND pad on the die, viewed with
active area of product visible, relative to the notch-
es of the frame (as shown in Figure 2). The orien-
tation of the die with respect to the plastic frame
notches is specified by the Customer.
2/2
Sxy*: Sawn wafer (std UV tape)
Rxy*: Sawn wafer (insolated UV tape) or SO on tape and reel
Wxx: Unsawn wafer
Oxx: SO package
Dxx: Module contact or dual
Cxx: Contactless modules
Example:
ORIENTATION
Product name
Delivery Form
1
GND
ST19SF08C
VIEW: WAFER FRONT SIDE
2
GND
D45
One further concern, when specifying devices to
be delivered in this form, is that wafers mounted
on adhesive tape must be used within a limited pe-
riod from the mounting date:
– two months, if wafers are stored at 25°C, 55%
– six months, if wafers are stored at 4°C, 55% rel-
relative humidity
ative humidity
GND
3
XXX
Z
GND
“+” if no pre-personalization
Customer ROM code name
4
Pre-personalization name
AI02171